Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
