AG-919 Heat Stable Silver Ink


  • Flex Circuits
  • Membrane Switches
  • EMI/RFI Shielding
  • Other printed electronic applications


  • High conductivity
  • Screen printable
  • Outstanding crease resistance
  • Extremely heat stable, tough, and scuff resistant
  • Has excellent adhesion to most metal surfaces, as well as to polyester polyimide and polycarbonate films.
  • Can be thinned with solvent for spraying or dipping for EMI/RFI shielding applications
  • Can be printed as thin base layers for plating processes

AG-919 is compatible with our UV curable dielectrics, silver/silver chloride inks, conductive epoxy adhesives, and our UV curable component encapsulants and conformal coatings.