MicroSpray is based on long proven, mature, novolak technology. It is ideally suited for developmental applications including perforated, 3-dimensional and other substrates that have severe topography, deep V grooves, back side wafer protection or other difficult MEMS features. MicroSpray is also available with SU-8.
Gwen Donahue, MEMS Engineer with MicroCHIPS, Inc. says, “I was very pleased with the results of MicroSpray. The coverage of the 100µm sidewalls is exactly what I wanted to see on these wafers and I was unable to get this result using spin on resist.”