MicroSpray is based on long proven, mature, novolak technology. It is ideally suited for developmental applications including perforated, 3-dimensional and other substrates that have severe topography, deep V grooves, back side wafer protection or other difficult MEMS features. MicroSpray is also available with SU-8.

Gwen Donahue, MEMS Engineer with MicroCHIPS, Inc. says, “I was very pleased with the results of MicroSpray. The coverage of the 100µm sidewalls is exactly what I wanted to see on these wafers and I was unable to get this result using spin on resist.”

Material uses:

  • Conformal coatings
  • Backside coatings
  • Protective coatings
  • MEMS devices
  • Decorative etching
  • Prototyping

Material attributes:

  • No coating equipment required
  • Minimal waste
  • Coats over non-planar surfaces
  • Coats irregularly shaped substrates
  • Covers the sidewalls and edges of trenches
  • Produces uniform coatings on perforated substrates
Patterned through wafer vias
Micro-machined cavities
5 µm coating of MicroSpray in a 25 µm deep silicon cavity