SU-8 3000CF Dry Film Resist (DFR) Series is a negative-tone, permanent epoxy dry film designed for fabricating chemically and thermally stable microstructures.
Built on a low-halogen, antimony-free epoxy formulation, SU-8 3000CF Dry Film enables high aspect ratio structures such as cavity walls, capping layers, and structural features in advanced microelectronic and MEMS applications.
Use SU-8 3000CF to build defect-free thick epoxy structures over topography, thanks to lamination and uniformity control.
It is well suited for applications such as wafer-level packaging, MEMS sensors, passivation layers, RF filter cavity packages (SAW/BAW), and microfluidic devices, where dimensional accuracy, strong adhesion, and long-term reliability are critical.
SU-8 3000CF Dry Film Resist provides flexible control of total film thickness using single-layer, multilayer, or hybrid dry film/liquid resist processing. Dry film layers can be stacked sequentially to build thicker structures while maintaining excellent resolution, vertical sidewalls, and mechanical stability.
Available Dry Film Thicknesses
These thicknesses may be used individually or combined in multiple dry film layers to achieve custom total thickness targets.
SU-8 dry film can be combined with liquid SU-8 resists for intermediate thickness requirements
Tech Reference #1
Enabling fast microfluidic chips fabrication: A practical guideline for microfluidics design and fabrication using photolithography for fast prototyping
Zhang, Z. et al., Journal of Micromanufacturing, 2025
