Product Categories

Elevate your manufacturing process with our line of photoresists & specialty chemicals

Photo-patternable Epoxies
  • Description

    Negative-tone epoxies that form permanent, chemically resistant structures after exposure and curing.

  • Used for

    Building high-aspect microstructures, channels, and wafer-bonded layers in MEMS and microfluidic devices.

Lift-off Resists
  • Description

    Photoresists that act as temporary masks for metal deposition and are removed after patterning.

  • Used for

    Clean lift-off processes in metal patterning, electrode formation, and T-gate fabrication.

Temporary Resists Illustration
  • Description

    Thick, temporary photoresists that serve as molds for electroplating.

  • Used for

    Creating metal pillars, vias, and redistribution layers in advanced packaging.

Patterned Features with Low K Dielectrics
  • Description

    Permanent photoimageable dielectric materials with low dielectric constants (Low-k).

  • Used for

    Insulating and passivating layers in RF, sensors, and advanced packaging devices where signal integrity matters.

Ancillaries Illustration
  • Description

    Supporting materials that ensure reliable adhesion, development, and clean removal.

  • Used for

    Surface preparation, coating stability, and process compatibility across StructSure resists.