Permanent Photo-Patternable Epoxies

Negative-tone, epoxy-based photoresists engineered for permanent microstructures. Designed for high aspect ratio imaging, chemical resistance, and long-term stability across MEMS, microfluidics, and optical applications.

Compatible with standard UV lithography systems. Ancillary developers, thinners, and removers available for each formulation.

SU-8

StructSure™ SU-8 is a negative photoresist designed for permanent, chemically resistant structures. Its epoxy base enables excellent adhesion, low stress, and long-term stability after crosslinking.

Ideal for

SU-8

SU‑8 is a high‑performance, epoxy‑based photoresist engineered for advanced micromachining and microelectronic fabrication. Designed for applications requiring thick, chemically robust, and thermally stable structures, SU‑8 delivers exceptional image quality and durability.

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SU-8 3000

SU‑8 3000 is a high‑contrast, epoxy‑based photoresist engineered for micromachining and advanced microelectronic fabrication.

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SU-8 TF 6000

SU‑8 TF 6000 is a high‑contrast, chemically amplified, negative‑tone epoxy photoresist designed for high‑resolution, thin, permanent microstructures.

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SU-8 XFT 75 & 100

The SU‑8 XFT series is a high‑contrast, epoxy‑based photoresist engineered for micromachining and advanced microelectronic applications requiring ultra‑thick, chemically and thermally stable structures.

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SU-8 3000CF Dry Film Resist

SU-8 3000CF Dry Film Resist (DFR) Series is a negative-tone, permanent epoxy dry film designed for fabricating chemically and thermally stable microstructures.

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Ancillaries

Often used with SU-8

EBR PG

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

SU-8 Developer

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

CP Thinner

Used With SU-8 3000, SU-8 XFT 75 & 100.

CPG Thinner

Used With SU-8 TF 6000.

MicroChem Remover 1112A

Used With SU-8.

Remover PG

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

EBR PG

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

CP Thinner

Used With SU-8 3000, SU-8 XFT 75 & 100.

CPG Thinner

Used With SU-8 TF 6000.

SU-8 Developer

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

MicroChem Remover 1112A

Used With SU-8.

Remover PG

Used With SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, SU-8 3000CF Dry Film Resist.

KMPR®

Use KMPR® 1000 for thick MEMS molds. It offers strong adhesion, etch resistance, and facile removal after processing.

Ideal for

KMPR® 1000

KMPR® 1000 is a high‑contrast, epoxy‑based i‑line photoresist designed for easy processing and reliable patterning.

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Ancillaries

Often used with KMPR

EBR PG

Used With KMPR® 1000.

CP Thinner

Used With KMPR® 1000.

CD26 Developer

Used With KMPR® 1000.

SU-8 Developer

Used With KMPR® 1000.

Remover PG

Used With KMPR® 1000.

EBR PG

Used With KMPR® 1000.

CP Thinner

Used With SU-8 TF 6000.

SU-8 Developer

Used With KMPR® 1000.

Remover PG

Used With KMPR® 1000.

PermiNex®

Pattern and bond wafers with PermiNex adhesives. They deliver high bond integrity, fine features, and robust adhesion at < 200 °C.

Ideal for

PermiNex® 1000 and 2000 Wafer Bonding Adhesives

PermiNex® 1000 and 2000 are epoxy‑based, photo‑imageable bonding resists engineered for high‑precision adhesive layers in advanced device packaging.

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Ancillaries