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Overview

Designed for cavity definition and capping in applications such as BAW, SAW, and microfluidic devices, these resists provide excellent alignment accuracy, low‑temperature processing, and high‑quality bond formation.

Perminex adhesives enable patterning and bonding of wafers with high bond integrity, fine features, and robust adhesion at processing temperatures below 200 °C.

The PermiNex® series is ideal for microelectronic and microfluidic manufacturing environments where structural integrity and process flexibility are essential.

Key features

  • Negative tone, photo-imageable adhesives
  • Alkaline and solvent developable series
  • High resolution patterning
  • Low temperature processing (< 200°C)
  • High quality, void-free bonding
  • Superb adhesion to silicon and glass
  • Good process compatibility (dicing, soldering) and high reliability (HAST, TCT)

  • Material uses
  • Wafer bonding
  • Wafer thinning support
  • Backside processing support
  • Through-silicon via (TSV) processing
  • Wafer debonding workflows

Industry Applications

  • Advanced semiconductor packaging

  • 3D integration and TSV manufacturing
  • MEMS fabrication
  • Power device processing (Si, SiC, GaN)
  • Compound semiconductor manufacturing
  • Thin-wafer and fragile substrate processing
  • Microfluidics

Recommended ancillaries

PermiNex 1000

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EBR PG

Edge Bead Remover
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CP Thinner

To dilute SU-8 3000 & KMPR® 1000 resists.
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PN 1000 Developer

PermiNex® 1000 resist development
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Remover PG

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists
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PermiNex 2000

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EBR PG

Edge Bead Remover
View Details
Add to Quote

CP Thinner

To dilute SU-8 3000 & KMPR® 1000 resists.
Add to Quote

CD26 Developer

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Remover PG

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists
View Details
Add to Quote

Downloads

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