Photo-patternable dielectric materials engineered for advanced packaging and high-frequency applications. Formulated for low dielectric constant, low stress, and reliable performance in wafer-level and interposer processes.
Cures at low temperatures to minimize wafer warpage. Compatible with standard photolithography and metallization process flows.
Photo-patternable low-k dielectrics from Kayaku offer low Dk/Df for high-frequency reliability. Engineered for RDL, interposers, and wafer-level packaging.
Ideal for
Ancillaries
Used With KMSF® 2000 Low Dk/Df Photo-dielectric, and KMSF® 1000 Low Stress Photo-dielectric.
Used With KMSF® 2000 Low Dk/Df Photo-dielectric.
Used With KMSF® 1000 Low Dk/Df Photo-dielectric.
Used With KMSF® 1000 Low Stress Photo-dielectric.
Used With KMSF® 2000 Low Dk/Df Photo-dielectric, and KMSF® 1000 Low Stress Photo-dielectric.
Used With KMSF® 2000 Low Dk/Df Photo-dielectric.
Used With KMSF® 1000 Low Dk/Df Photo-dielectric.
Used With KMSF® 1000 Low Stress Photo-dielectric.
