Overview

KMSF® 2000 is a negative‑tone, low‑temperature‑cure PPE‑copolymer photo‑dielectric designed for high‑reliability heterogeneous integration in advanced packaging. It features excellent pattern resolution, a low dielectric constant (Dk = 2.5), and a low dissipation factor
(Df = 0.003), making it ideal for high‑frequency applications requiring superior signal integrity.

Engineered for consistent performance, KMSF® 2000 supports an optimal cured film thickness of 5–10 μm, providing versatility and stability for next‑generation electronic packaging solutions.

Key features

Negative tone, photoimageable dielectric
5 to 10 µm film thickness after cure
Solvent-developable in PGMEA
i-Line/broadband sensitivity, 1:1 aspect ratio imaging
Low temperature cure ≤ 200°C
Low Dk/Df electrical properties
Low moisture uptake
Good thermal and chemical stability

Material uses
Redistribution layer (RDL) dielectric
Passivation layer
Interlayer dielectric (ILD)
Wafer-level packaging (WLP) dielectric
Protective dielectric layer

Industry Applications

5G & 6G communication systems
5G mmWave and sub-6 GHz RF systems
Telecommunication infrastructure and base stations
RF and microwave chips and modules
Antenna modules and Antenna-in-Package (AiP)
Advanced semiconductor packaging and RDL-based integration
Radar and high-frequency sensing systems

Documentation

Tech Reference #1

Novel low temperature curable photo-patternable low Dk/Df for wafer level packaging (WLP)
K. Han et al., IEEE 70th Electronic Components and Technology Conference (ECTC), 2020

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