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Overview

Built on a low-halogen, antimony-free epoxy formulation, SU-8 3000CF Dry Film enables high aspect ratio structures such as cavity walls, capping layers, and structural features in advanced microelectronic and MEMS applications. Use SU-8 3000CF to build defect-free thick epoxy structures over topography, thanks to lamination and uniformity control. It is well suited for applications such as wafer-level packaging, MEMS sensors, passivation layers, RF filter cavity packages (SAW/BAW), and microfluidic devices, where dimensional accuracy, strong adhesion, and long-term reliability are critical.

Key features

  • Permanent Epoxy Dry Film ideal for structural and protective layers
  • Antimony-Free & Low Halogen
  • Excellent Resolution & 3:1 Aspect Ratio
  • Low Process Temperature
  • Outstanding Thermal Stability up to ~250 °C
  • Low Water Absorption
  • Proven Reliability – No delamination or corrosion after HAST

  • Material uses
  • SAW & BAW filter cavity packages
  • MEMS sensor structures
  • Wafer-level & panel-level packaging
  • Glass or wafer capping layers
  • Low-profile cavity packages
  • Microfluidic channels and structures

Applications

Application Notes

Film thickness & build up flexibility

SU-8 3000CF Dry Film Resist provides flexible control of total film thickness using single-layer, multilayer, or hybrid dry film/liquid resist processing. Dry film layers can be stacked sequentially to build thicker structures while maintaining excellent resolution, vertical sidewalls, and mechanical stability.

Available Dry Film Thicknesses

  • 20 µm
  • 30 µm
  • 45 µm

These thicknesses may be used individually or combined in multiple dry film layers to achieve custom total thickness targets.

SU-8 dry film can be combined with liquid SU-8 resists for intermediate thickness requirements

Process Compatibility

  • Lamination-based dry film process
  • Broadband or i-line UV exposure (365 nm)
  • PGMEA solvent development
  • Post-exposure bake and hard bake for permanent structures
  • Recommended long-pass UV filter (<350 nm cutoff) for vertical sidewalls

  • Industry Applications
  • MEMS and microsystem manufacturing
  • High-aspect-ratio electroplated metal microstructures
  • Microfluidic and lab-on-chip device fabrication
  • Wafer-level and panel-level packaging
  • Precision micromechanical components and microfabrication

Documentation

Tech Reference #1

Enabling fast microfluidic chips fabrication: A practical guideline for microfluidics design and fabrication using photolithography for fast prototyping
Zhang, Z. et al., Journal of Micromanufacturing, 2025

Download Publication

Recommended ancillaries

Remover PG

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists
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SU-8 Developer

SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, KMPR 1000, and KMSF 2000 resist development.
Add to Quote

EBR PG

Edge Bead Remover
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