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Overview

TempKoat® N is a chemically amplified, negative‑tone temporary resist designed for advanced packaging and MEMS applications. Engineered for fast processing, it produces high‑aspect‑ratio features with minimal cycle time while maintaining excellent resolution and strong chemical resistance.

With clean, residue‑free removal, TempKoat® N is ideal for state‑of‑the‑art temporary masking and patterning in advanced microfabrication. TempKoat® N 15 is the first available dilution in the TempKoat® N series.

* Note: Product not commercially available within the United States; however, small scale quantities may be purchased in the United States for R&D purposes.

Key features

  • Negative tone, chemically amplified resist
  • 7 to 20 µm film thickness in a single coat
  • i-Line/broadband sensitivity, 2:1 achievable aspect ratio
  • No rehydration or latency delay
  • Aqueous alkaline development (standard 0.26N TMAH)
  • Excellent resistance to copper plating chemistries
  • Residue-free removal

Industry Applications

  • Fan-in and fan-out wafer-level packaging (WLP)

  • Redistribution layer (RDL) fabrication for advanced packaging
  • Microbumping and fine-pitch electroplated interconnects
  • MEMS wafer processing and metallization

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