Materials Enabling the Connected World

Explore Kayaku’s worldwide network of facilities, partners, and service hubs — each connecting you to advanced materials, engineering support, and regional expertise.

From data centers to smart homes, Kayaku Advanced Materials powers the technologies that shape modern life.

Smart Homes & Connected Living

Advanced materials enabling wireless connectivity, MEMS sensors, and miniaturized electronics in everyday devices.

Core Technologies: 
  • WiFi & RF modules 
  • MEMS & sensors 
  • Consumer electronics (phones, tablets, laptops, gaming consoles) 
  • Displays & optical components 
Materials Enabling This Sector 

RF Dielectrics 

Lift-Off & Fine Patterning 

MEMS & Structural Resists 

Advanced Packaging 

Entertainment & High-Performance Electronics

Materials enabling RF communication, signal processing, and precision MEMS in advanced audio-visual systems.

Core Technologies:
  • RF front-end modules
  • Projection & imaging systems
  • Audio MEMS
  • High-speed processors
Materials

RF & Signal Integrity 

MEMS & Structural Layers 

Lift-Off & Fine Patterning 

Bonding 

Industrial & Power Electronics 

High-reliability materials supporting wide bandgap devices, automation, and power management systems.

Core Technologies:
  • GaN & SiC power devices
  • Automotive radar & power management ICs
  • AI processors & data center chips
  • Harsh-environment packaging
Materials

RF & Power Dielectrics 

Thick Structural & Plating Resists 

Bonding Solutions 

Protective Coating 

Education & Connected Devices

Miniaturized materials enabling connected computing devices, MEMS microphones, and wireless modules.

Core Technologies:
  • Tablets & laptops
  • Wireless communication
  • MEMS and sensors
  • Edge computing
Materials

RF Modules 

Advanced Packaging 

Fine Patterning and lift off 

MEMS Structures 

Data Centers & Commercial Infrastructure

Materials supporting AI acceleration, cloud computing expansion, and high-speed interconnect technologies. 

Core Technologies: 
  • High-density packaging 
  • Network infrastructure 
  • CPUs & DRAM chips 
  • GPUs & AI accelerators 
Materials 

High-Speed Dielectrics 

Plating & RDL Photoresists 

Structural & Cavity Layers 

Wafer Bonding 

Healthcare & Medical Devices

Precision materials enabling lab-on-chip diagnostics, biosensors, and medical MEMS devices.

Core Technologies:
  • Lab-on-chip & Organ on chips
    • Microfluidics
    • MEMS biosensors
    • Diagnostic electronics
Materials

Microfluidics & MEMS

5G, 6G & RF Infrastructure

High-frequency dielectric and structural materials enabling GaN HEMT devices and antenna modules.

Core Technologies:
  • GaN HEMT
  • RF front-end modules
  • Antenna-in-Package
  • mmWave radar systems
Materials

RF Dielectric 

Stress Control 

Structural & Cavity Layers 

Bonding 

Protective Coating  

Agriculture & IoT

Distributed sensing and low-power communication materials enabling smart farming and environmental monitoring.

Core Technologies:
  • Environmental sensors
  • Analog MEMS
  • Wireless IoT modules
  • Display systems
Materials

MEMS and Sensor Fabrication 

RF Connectivity 

Fine Patterning 

Aerospace & High-Reliability Systems 

Thermally stable and RF-compatible materials supporting radar, satellite communication, and power systems.

Core Technologies:
  • Radar systems, mmsubwave systems
  • Satellite communication
  • Wide bandgap devices
  • Harsh-environment electronics
Materials

RF Dielectric 

Low-Stress Buffer 

Structural Materials 

Bonding 

Protective Coating