Navigation

Overview

Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.

  • High resolution capability (~ 40 – 50 nm)
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

Applications

  • E-beam Lithography
  • Negative DUV/e-beam

Recommended ancillaries

Remover PG

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists
Add to Quote

MRT Developers

Add to Quote

MRT Removers

Add to Quote

ma-D 525

Add to Quote

Downloads