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Overview

mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.

  • Excellent stability in plasma etching processes
  • Fast curing even with low intensity light exposure source
  • Excellent liquid thin film stability and thin film quality
  • Outstanding compatibility with flexible stamp materials
  • Residue-free removal with oxygen plasma post-cure

Applications

  • Soft UV-based NIL
  • Etch mask for pattern transfer processes (dry and wet etching)
  • Fabrication of nanostructures

Downloads

mr-NIL212FC

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