Overview

Photoresist series designed for the use in microelectronics and microsystems technology

Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
Very good pattern stability in wet etch processes & acid & alkaline plating baths
Highly stable in dry etch processes, e.g. CHF₃, CF₄, SF₆
Broadband, g-, h- and i-Line exposure

Applications

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists

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