Supporting materials that make every process step reliable

Our ancillary materials ensure consistent results across every stage of microfabrication. From surface preparation to final cleaning, these developers, removers, primers, and solvents keep your process stable, repeatable, and contamination-free.

Process Overview

Each stage of lithography and coating depends on the right supporting materials

  • Prep

    Adhesion Promoters

  • Coat

    • Solvents
    • Thinners
  • Expose

    Surface Control Agents

  • Develop

    Developers

  • Strip

    Removers

  • Clean / Bond

    • Cleaning Solvents

Ancillaries by function

Developers

Ensure clean, precise pattern development.
Our developers deliver consistent dissolution rates, smooth sidewalls, and full compatibility with Kayaku photoresists.

CD-26 Developer

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PN 1000 Developer

Used with PermiNex® 1000
PermiNex® 1000 resist development
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KMSF® Developer

Used with KMSF®1000
Development of KMSF 1000
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SU-8 Developer

Used with SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, KMPR 1000, KMSF 2000, SU-8 3000CF DFR
SU-8, SU-8 3000, SU-8 TF 6000, SU-8 XFT 75 & 100, KMPR 1000, and KMSF 2000 resist development.
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MIBK IPA 1:1

Used with PMMA
High speed PMMA & copolymer resist development.
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MIBK IPA 1:2

Used with PMMA
PMMA & copolymer resist development.
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MIBK IPA 1:3

Used with PMMA
High resolution PMMA & copolymer resist development.
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Metal Ion bearing (MIB)

MicroChem 303 A Developer

Holographic lithography and general microelectronics
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MicroChem 455 Developer

Used with SU-8
Development of Qnity® S1800® and other commercially available photoresists.
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MicroChem 452 Developer

Used with SU-8
MicroChem 303 A Developer is an aqueous alkaline solution. It is suitable for all general microelectronic applications.
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TEAH (Tetra ethyl ammonium hydroxide)

PMGI 101 Developer

Used with PMGI
PMGI resist development
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Removers

Achieve efficient residue‑free resist stripping. Our removers are engineered for fast dissolution, material compatibility, and superior cleanliness—ensuring smooth rework cycles and reliable lift-off performance.

Remover 1165

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Remover 1112A

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Remover PG

To strip PMGI, LOR, PMMA, KMPR® 1000 & minimally cross-linked SU-8 resists
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Edge Bead Remover

EBR-10A Edge Bead Remover

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EBR PG

Edge Bead Remover
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Adhesion Promoters

Secure stronger, more dependable resist anchoring. Our adhesion promoters enhance bonding across challenging substrates, reducing delamination, improving pattern quality, and boosting overall process robustness.

Adhesion Promoter/Release Layer

OmniCoat

Used with SU-8
Adhesion Promoter
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Solvents & Thinners

Optimize material performance with precision‑balanced formulations. Our solvents and thinners enable controlled viscosity adjustment, uniform coating behavior, and full compatibility with Kayaku chemistries for consistent, high‑quality results.

EL Thinner

To dilute copolymer resists
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G Thinner

Used with LOR/PMGI SFG S, LOR/PMGI LOR A, LOR/PMGI LOR B
To dilute PMGI SF resists
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T Thinner

Used with LOR/PMGI SF, LOR/PMGI SF S
To dilute PMGI SF resists
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CPG Thinner

Used with SU-8 TF 6000
To dilute SU-8 TF 6000 resists
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CP Thinner

Used with SU-8 3000, SU-8 XFT 75 & 100, PermiNex 1000, PermiNex 2000, KMPR 1000
To dilute SU-8 3000 & KMPR® 1000 resists.
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Thinner C

Used with 495 PMMA C, 950 PMMA C
To dilute PMMA C resists
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Thinner A

Used with 950 PMMA A, 495 PMMA A
To dilute PMMA A resists
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