Part of the Qnity Lines
Intervia™ 8540HSP Electroplating Copper is designed for Cu pillar and redistribution layer plating applications. As a three component system, Intervia™ 8540HSP Copper is able to achieve a finely tuned deposit morphology across a wide variety of Cu pillar feature sizes, while maintaining within-die (WID) and within-wafer (WIW) uniformity. The pillar and RDL trace profile shapes are also tunable by adjusting the dosing of Intervia™ 8540HSP Leveler in the plating bath. The Cu deposits from Intervia™ 8540HSP Copper are highly pure, enabling void-free integration with barrier and solder materials.
Kayaku Advanced Materials, Inc.’s distribution of Qnity Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise. Kayaku Advanced Materials only represents Qnity in North America.
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