Kayaku Advanced Materials supplies a focused portfolio of Qnity Advanced Packaging Technologies, offering high‑performance materials engineered for fine‑pitch and high‑reliability semiconductor packaging. This includes advanced plating chemistries such as INTERLINK™ 9200 Cu TSV, InterVia™ 8540HSP, InterVia™ Cu 8540, Palledep BP, and Solderon BP TS 6000, along with thick and electrophoretic resists like InterVia BPR™‑100, InterVia™ 3D‑N, and 3D‑P. Complemented by dielectric systems such as the CYCLOTENE™ 3000/4000 Series, AP3000, and InterVia™ Photodielectric 8023, these materials enable robust interconnect formation and advanced wafer‑level packaging performance.
Used in back-end semiconductor manufacturing for copper TSV filling, redistribution layer formation, and microbump plating in advanced flip-chip and 3D packaging processes.
