Part of the Qnity Lines
SOLDERON BP TS 6000 Tin/Silver bump plating bath is a newly redesigned formulation specifically for use in a semiconductor wafer plating process, producing reflowable SnAg solder bumps for flip-chip packaging and 2.5D/3D packaging applications. This next-generation chemistry delivers industry-leading plating rates, enhanced plating performance, bath stability and ease-of-use and maximum process flexibility.
Kayaku Advanced Materials, Inc.’s distribution of Qnity Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise. Kayaku Advanced Materials only represents Qnity in North America.
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