Overview
SU-8 3000CF Dry Film Resist (DFR) is a low-halogen, antimony-free formulation designed to minimize generation of chlorine species that can cause corrosion. This corrosion free resist enables high aspect ratio structures such as cavity walls, capping layers, and structural features in advanced microelectronic and MEMS. Dry film processing provides flexible control of total film thickness using single-layer, multilayer, or hybrid dry film/liquid resist methodology. Dry film layers can be stacked sequentially to build thicker structures while maintaining resolution, vertical sidewalls, and mechanical stability. The available dry film layer thicknesses of SU-8 3000CF are 20, 30, and 45 μm. For more information, see the SU-8 3000CF technical data sheet.
Application
SU-8 3000CF is well suited for applications where dimensional accuracy, strong adhesion, and long-term reliability are critical. Examples include wafer-level packaging, MEMS sensors, passivation layers, radio frequency (RF) filter cavity packages (SAW/BAW), and microfluidic devices. Also, SU-8 3000CF is formulated to be corrosion free so it is ideal for applications where devices must withstand corrosive environments during their life cycle.
Key Feautres
- Antimony-free & low halogen formulation
- 3:1 aspect ratio resolution
- Low process temperature and excellent thermal stability up to ~250°C
- Low water absorption
- Proven reliability after HAST
Corrosion Testing
SU-8 3000CF was processed using standard conditions included in the Technical Data Sheet for highly accelerated stress testing (HAST) on an Al coated Si wafer (Figure 1). This device simulates cavity packaging to verify the protective, corrosion resistant performance of SU-8 3000CF.
To simulate a harsh environment, the HAST was conducted at 85°C with 85% RH for 100-1000 hours. The typical SU-8 3000 formulation exhibits corrosion after 100 hrs of testing, whereas the SU-8 3000CF resist withstands 1000 hrs of testing with no visible corrosion or delamination (Figure 2). The protected, enclosed region remains free from contamination under this stress test as seen post-removal.
Industrial Relevance
In general, dry film resist is preferred for applications where uniformity and thickness control is critical. Even when stacking multiple DFR layers for thicker applications, edge bead thickness variation remains minimal thus increasing usable wafer area for higher yield.[1] This is a key advantage for high volume manufacturing preparedness.
SU-8 3000CF’s formulation enables packaging and protection applications where corrosion is a concern, while maintaining the uniformity advantages of a dry film. Specifically, protection of acoustic wave filters for RF devices such as SAW/BAW filters can be accomplished SU-8 3000CF.[2-3] It is also particularly useful for microfluidic devices and sensors where exposure to humidity or fluids is expected.[4-6] Importantly, the material’s high thermal stability and strong adhesion to substrates allows it to withstand variable environmental conditions for robust advanced packaging solutions.
References
[1] S. Farjana et. al. Micromachines, 12(3), 260, (2021). https://doi.org/10.3390/mi12030260
[2] N. Honda et al. CS MANTECH Conference, 22-25, (2017).
[3] X. Liu et. al. Micromachines, 16(3), 320, (2025). https://doi.org/10.3390/mi16030320
[4] Z. Zhang and D. Nawrocki, Journal of Micromanufacturing, (2025). doi: 10.1177/25165984251364687
[5] W. Kubicki et. al. XV International Scientific COE, 1-3, (2018). doi: 10.1109/COE.2018.8435152
[6] Y. Hirata, et al. IEEE 30th International Conference on MEMS, 13-16, (2017).
