Broadband Resists for Wet Etch

MICROPOSIT™ S1800® G2 Series Photoresists

Optimized for g-Line exposure, the S1800 G2 Series delivers consistent coating uniformity and strong substrate adhesion for reliable patterning results.
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MEGAPOSIT™ SPR™3000 Series Photoresists

MEGAPOSIT™ SPR™3000 is a positive photoresist designed for multi‑wavelength UV lithography, delivering high‑resolution, stable performance across g‑line, h‑line, and i‑line regimes.
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Advanced i-Line Resists (3-10 µm)

 

MEGAPOSIT™ SPR™955-CM Series High Resolution i-Line Photoresists

The MEGAPOSIT™ SPR™ 955-CM Series is a general purpose, high-throughput i-Line photoresist designed for 0.35 µm front-end and back-end applications. It performs across dense lines/spaces, contact holes, isolated lines, and trenches on a variety of substrates.
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MEGAPOSIT™ SPR™660 Series Advanced i-Line Photoresists

The MEGAPOSIT™ SPR™ 660 Series is an advanced i-Line photoresist designed for processing 0.350 micron features and larger. It performs in both line/space and contact hole applications across a variety of substrates, including silicon, silicon dioxide, and titanium nitride.
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MEGAPOSIT™ SPR™3600M Series Advanced i-Line Photoresists

Dyed i-Line photoresist engineered for high throughput processing on reflective substrates, with multiwavelength capability and compatibility across a wide range of developer families.
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MEGAPOSIT™ SPR™ 220 Series Thick i‑Line Photoresists

The MEGAPOSIT™ SPR™ 220 Series is a thick i-Line photoresist that supports broadband, g-Line, and i-Line exposure.
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Positive DUV Resists

UV™6 Positive DUV Resist

UV6 Positive DUV Photoresist has been optimized to provide vertical profile imaging of dense and semi-isolated features for device production design rules to 180 nm.
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UV™ 26 Positive DUV Resist

UV26 is a positive DUV Photoresist developed for deep implant Applications. The low viscosity of UV26 allows for reduced dispense volume and improved coating uniformity for films ranging from 1.1 µm to 3.0 µm.
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UV™ 210GS Positive DUV Photoresist

UV210 is a multi-purpose resist that can be utilized for gate, fill, mask, contact holes, and trench applications in the 180-130 nm CD range.
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UV™ 135 Positive DUV Photoresist

The UV™135 is a positive DUV photoresist designed for advanced gate applications at 130 nm design rules. It supports use across multiple pitches using a binary mask.
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Nanoimprint Lithography Resists

UVN® 30 Negative DUV Photoresist

UVN30 is a negative-tone photoresist for DUV, X-Ray and e-beam applications.
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Lift-off Layers

MICROPOSIT™ LOL™ 1000 & LOL 2000 Liftoff Layers

MICROPOSIT LOL 1000/2000 Liftoff Layer is an enhanced dissolution rate, dyed PMGI (polymethylglutarimide) solution used for lift-off processes requiring tight CD control, such as GMR thin film head, gallium arsenide, and other leading-edge semiconductor applications.
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