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Posts by category
- Category: Newsroom
- Category: Publications
- Lift-off Resists for Optical Filters Using High-Temperature Sputtering
- Optimizing Bi-layer Lift-off Resist Processes for Insulator Films
- Bi-Layer Lift-off Resist Process Optimization of Insulator Film for Neural Probe Fabrication
- Optimization of Bi-layer Lift-off Resist Process
- Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging
Products
- EBR-10A Edge Bead Remover
- Remover 1165
- Remover 1112A
- MicroChem 303 A Developer
- EL Thinner
- G Thinner
- T Thinner
- CPG Thinner
- CP Thinner
- OmniCoat
- PMGI 101 Developer
- MicroChem 455 Developer
- MicroChem 452 Developer
- PN 1000 Developer
- KMSF® Developer
- SU-8 Developer
- Thinner A
- Thinner C
- Remover PG
- MIBK IPA 1:3
- MIBK IPA 1:2
- MIBK IPA 1:1
- EBR PG
- OrmoStamp®
- OrmoCore/OrmoClad
- OrmoComp® / OrmoClear®FX
- OrmoClear®
- SIPOL
- mr-XNIL26SF
- mr-UVCur26SF
- mr-NIL212FC
- mr-NIL210
- mr-NIL200
- mr-NIL 6000E
- mr-I T85
- mr-I 9000M
- mr-I 7000R/8000R
- mr-EBL 6000
- ma-N 2400
- mr-DWL
- ma-N 400/ma-N 1400
- EpoCore/EpoClad
- ma-P 1275HV
- ma-P 1200LIL
- ma-P 1200G
- ma-P 1200
- InterVia™ Photodielectric 8023 Series
- CYLOTENE Adhesion Promoter AP3000
- CYCLOTENE 4000 Series
- CYCLOTENE 3000 Series
- InterVia™ 3D-P Electrophoretic Photoresist
- InterVia™ 3D-N Electrophoretic Photoresists
- InterVia BPR™-100 Thick Photoresist
- Solderon BP TS 6000
- Palledep BP
- InterVia™ Cu 8540
- InterVia™ 8540HSP
- INTERLINK™ 9200 Cu TSV
- MICROPOSIT™ LOL™ 1000 & LOL 2000 Liftoff Layers
- UVN® 30 Negative DUV Photoresist
- UV™6 Positive DUV Resist
- UV™ 26 Positive DUV Resist
- UV™ 210GS Positive DUV Photoresist
- UV™ 135 Positive DUV Photoresist
- MEGAPOSIT™ SPR™955-CM Series High Resolution i-Line Photoresists
- MEGAPOSIT™ SPR™660 Series Advanced i-Line Photoresists
- MEGAPOSIT™ SPR™3600M Series Advanced i-Line Photoresists
- MEGAPOSIT™ SPR™ 220 Series Thick i‑Line Photoresists
- MICROPOSIT™ S1800® G2 Series Photoresists
- MEGAPOSIT™ SPR™3000 Series Photoresists
- KMSF® 2000 Low Dk/Df Photo-dielectric
- KMSF® 1000 Low Stress Photo-dielectric
- SU-8 3000CF Dry Film Resist
- TempKoat® N Negative Temporary Photoresist
- TempKoat® P Positive Temporary Photoresist
- UniLOR® N Lift-off Photoresists
- PMMA Positive Resists
- LOR & PMGI Lift-off Resists
- PermiNex® 1000 and 2000 Wafer Bonding Adhesives
- KMPR® 1000
- SU-8 XFT 75 & 100
- SU-8 TF 6000
- SU-8 3000
- SU-8