KayakuAM: A Leader in Photoresist & Polymer Coatings

Our commitment

Materials engineered for innovation, delivered with partnership

We combine advanced chemistry with process expertise to help you develop, scale, and commercialize breakthrough technologies.

Partnership for the long run

We collaborate closely with you from concept through commercialization, ensuring continuous technical and process support.

Custom formulations

Tailored photoresists and coatings engineered to fit your exact requirements.

Engineer-to-engineer support

Direct access to experts who understand your challenges and help solve them.

Scalable manufacturing

From lab-scale to high-volume, with reliability you can trust.

What we make

Proven photoresists and coatings trusted by engineers worldwide

Used in: 5G & RF Packaging, AiP and Radar Systems, RDL Dielectrics,
Wafer Level Packaging

Used in: MEMS Sensors, Optical Components, Metal Patterning, Single & Bi-layer lift off

Used in: Electroplating, Copper Pillars, RDL, Wafer Level Packaging

Used in: MEMS, Microfluidics, Optical Components, Permanent Structures

Used in: Surface Preparation, Adhesion Promotion , Developers, Process Cleaning

Our expertise

Beyond materials, we provide technical expertise and process support to help you succeed

Fabrication Services

Leveraging our photoresist expertise, we provide comprehensive solutions for prototyping and short-run fabrications.

See Fabrication Services

Paratronix Coating Services

Through Paratronix, we deliver industry-leading conformal coating services that protect and enhance electronic devices.

See Paratronix Services

Who we support

Our materials power innovations across critical industries — often unseen, but always essential

Sensors

Optoelectronics

Display

Medical

Lithography

Sensors

Wafer Bonding

Packaging

Nanoimprint

MEMS

Optics

Microfluidics

Our process

From first concept to full-scale production, we work alongside you every step of the way

Concept & Feasibility
Biocompatible polymers and protective layers for diagnostic chips, organ-on-a-chip platforms, and medical sensors.
Scale & Commercialization
Transition seamlessly from lab-scale validation to high-volume manufacturing with consistent quality and ongoing support.
Development & Iteration
Optimize materials and processes through testing and refinement to meet your application needs.

Partnership Message

We don’t just supply materials, we build lasting partnerships. Our team provides continuous technical guidance, ensuring your innovations succeed in both the lab  and the market.

Proof in practice

Field-proven outcomes

We combine advanced chemistry with process expertise to help you develop, scale, and commercialize breakthrough technologies.

Scaling microfabrication from concept to discovery

Challenge: A medical device company needed a robust two‑layer soft‑lithography process capable of rapidly prototyping 50 µm‑thick, high‑aspect‑ratio (5:1) features with 10 µm critical dimensions.
Approach: Worked closely with device engineers to co-develop a two-layer lithography process, optimizing materials, coating, and pattern transfer to consistently achieve demanding aspect-ratio requirements.
Result: Enabled stable fabrication of high-fidelity prototypes, accelerating experimental cycles and supporting deeper investigation into underlying therapeutic mechanisms.

Scaling advanced sensors from wafer to yield

Challenge: A sensor company needed a dielectric passivation layer for 100 µm-thick, high-aspect-ratio features without edge bead, which was reducing downstream performance and wafer yield.
Approach: Partnered with the customer’s process team to implement a dry-film resist, optimizing lamination and patterning conditions to suppress edge bead and maintain dimensional control.
Result: Delivered a high-yield, manufacturable process with minimal edge bead impact, improving device uniformity, increased number of devices per wafer, and overall process robustness.

Enabling metallization on complex compound semiconductor topography

Challenge: A compound semiconductor manufacturer needed to planarize severe mesa topography so metal contacts could be patterned reliably across highly non-planar device surfaces.
Approach: Applied a specialty lift-off resist technology to planarize mesa structures, creating a uniform surface that enabled reliable metal deposition and patterning without discontinuities.
Result: Enabled successful metallization across complex topography, supporting robust contact formation and advancing the customer’s compound semiconductor device development program.

We never disclose customer identities or proprietary details. All outcomes shown are de-identified and published with consent.

Our story

Where advanced materials meet global expertise and lasting collaboration

We are a U.S. manufacturer with a global footprint through Nippon Kayaku Group. Our mission is to advance innovation by combining dedicated R&D, scalable manufacturing, and close engineer-to-engineer collaboration across industries from semiconductors to life sciences.

Learn more about us