2 -part epoxy for component attachment, termination & surface bonding for membrane switches & other assemblies. Optimal epoxy for high speed dispensing.

Most plastic and metal substrates

Dot dispense, screen print, or manually dispense

<1.0 x 10^-3 Ω-cm

Black potting compound for electro/mechanical assemblies or components to protect against moisture, contamination, and mechanical or thermal shock. Allows for differences in coefficients of thermal expansion between two bonded substrates. Not thermally conductive.

Compatible with most materials, except Teflon and glass

Dot dispense or syringe application

<1.0 x 10¹⁴ Ω-cm