Specialty Photoresists
ma-P 1200
Part of the Micro Resist Technology Line
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist