Abstract Bi-layer lift-off metallization techniques offer significant advantages in resolution, removal, process simplicity, undercut control and yield over conventional single-layer lift-off processes. Because of its ease of application, long shelf life and lower tool cost, the polydimethylglutarimide (PMGI) bi-layer process has become an attractive method for the metallization of III-V compound semiconductor devices. The LOR/PMGI […]
