Publications
Optimizing Bi-layer Lift-off Resist Processes for Insulator Films
The bi-layer lift-off method has been used successfully to commercially fabricate many structures including source, drain ohmic contacts, gates and air bridges for use in Gallium Arsenide (GaAs), GaN, InP, MEMS and other semiconductor devices. It is widely adopted for...
Bi-Layer Lift-off Resist Process Optimization of Insulator Film for Neural Probe Fabrication
Abstract The bi-layer lift-off method is used commercially to fabricate many MEMS and semiconductor device structures and is deployed for metallization processes to fabricate neural probe electrodes. The process utilizes LOR/PMGI plus an imaging resist to create a...
Optimization of Bi-layer Lift-off Resist Process
Abstract Bi-layer lift-off metallization techniques offer significant advantages in resolution, removal, process simplicity, undercut control and yield over conventional single-layer lift-off processes. Because of its ease of application, long shelf life and lower...
Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging
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