Abstract The bi-layer lift-off method is used commercially to fabricate many MEMS and semiconductor device structures and is deployed for metallization processes to fabricate neural probe electrodes. The process utilizes LOR/PMGI plus an imaging resist to create a dual layer masking structure. Uniquely, this structure can be application customized because its composition and dimensions can […]

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Abstract Bi-layer lift-off metallization techniques offer significant advantages in resolution, removal, process simplicity, undercut control and yield over conventional single-layer lift-off processes. Because of its ease of application, long shelf life and lower tool cost, the polydimethylglutarimide (PMGI) bi-layer process has become an attractive method for the metallization of III-V compound semiconductor devices. The LOR/PMGI […]