Photoresists & Specialty Chemicals
TempKoat™ N Negative Temporary Photoresist
Part of the Kayaku Advanced Materials Line
TempKoat™ N is a chemically amplified, negative-tone resist series for advanced packaging and MEMS applications.
TempKoat™ N 15 is the first dilution available in the TempKoat™ N series and is optimized for thick resist applications from 7 to 20 μm.
Material Attributes:
|
Material Uses:
|
* Note: Product not commercially available within the United States; however, small scale quantities may be purchased in the United States for R&D purposes.
Lithography Process for TempKoat™ N 15
| Substrate | 150 mm Cu wafer |
| Spin Speed | 2000 rpm/30 seconds |
| Film Thickness | 15 µm |
| Soft Bake | 115°C, 3.5 minutes (hot plate) |
| Exposure | 85 mJ/cm2
ABM Broadband aligner with 360 nm long pass filter Intensity measured at 365 nm |
| PEB | 95°C, 2 minutes (hot plate) |
| Development | Spray develop with 0.26N TMAH Developer 2 x 60 seconds puddle |
15 µm trenches in 15 µm thick resist
Cu Plating Process for TempKoat™ N 15
| Surface Prep. | O2 Plasma
80SCCM, 350W, 3 minutes |
| Technic Elevate® Cu 6300 Cleaner (or equivalent)
room temperature, 1.5 minutes, shaker table |
|
| Plating | Technic Elevate® Cu 6388
I = 8.05A, 4.17 minutes, 80˚F |
| Resist Removal | DMSO-based remover (DuPont INTERVIA™ 2011 Remover)
Immersion and agitation for 15 minutes at ambient temperature |
15 µm Cu plated vias in 15 µm thick resist before and after resist removal
LEARN MORE>
15 µm trenches in 15 µm thick TempKoat™ N
before and after copper plating and resist removal
FEATURED APPLICATIONS