TempKoat™ N is a chemically amplified, negative-tone resist series for advanced packaging and MEMS applications.
TempKoat™ N 15 is the first dilution available in the TempKoat™ N series and is optimized for thick resist applications from 7 to 20 μm.
Material Attributes:
| Material Uses:
|
* Note: Product not commercially available within the United States; however, small scale quantities may be purchased in the United States for R&D purposes.
Lithography Process for TempKoat™ N 15
Substrate | 150 mm Cu wafer |
Spin Speed | 2000 rpm/30 seconds |
Film Thickness | 15 µm |
Soft Bake | 115°C, 3.5 minutes (hot plate) |
Exposure | 85 mJ/cm2 ABM Broadband aligner with 360 nm long pass filter Intensity measured at 365 nm |
PEB | 95°C, 2 minutes (hot plate) |
Development | Spray develop with 0.26N TMAH Developer 2 x 60 seconds puddle |

Cu Plating Process for TempKoat™ N 15
Surface Prep. | O2 Plasma 80SCCM, 350W, 3 minutes |
Technic Elevate® Cu 6300 Cleaner (or equivalent) room temperature, 1.5 minutes, shaker table | |
Plating | Technic Elevate® Cu 6388 I = 8.05A, 4.17 minutes, 80˚F |
Resist Removal | DMSO-based remover (DuPont INTERVIA™ 2011 Remover) Immersion and agitation for 15 minutes at ambient temperature |


15 µm Cu plated vias in 15 µm thick resist before and after resist removal