TempKoat™ N is a chemically amplified, negative-tone resist series for advanced packaging and MEMS applications.
TempKoat™ N 15 is the first dilution available in the TempKoat™ N series and is optimized for thick resist applications from 7 to 20 μm.
* Note: Product not commercially available within the United States; however, small scale quantities may be purchased in the United States for R&D purposes.
Lithography Process for TempKoat™ N 15
|Substrate||150 mm Cu wafer|
|Spin Speed||2000 rpm/30 seconds|
|Film Thickness||15 µm|
|Soft Bake||115°C, 3.5 minutes (hot plate)|
ABM Broadband aligner with 360 nm long pass filter
Intensity measured at 365 nm
|PEB||95°C, 2 minutes (hot plate)|
|Development||Spray develop with 0.26N TMAH Developer|
2 x 60 seconds puddle
Cu Plating Process for TempKoat™ N 15
|Surface Prep.||O2 Plasma|
80SCCM, 350W, 3 minutes
|Technic Elevate® Cu 6300 Cleaner (or equivalent)|
room temperature, 1.5 minutes, shaker table
|Plating||Technic Elevate® Cu 6388|
I = 8.05A, 4.17 minutes, 80˚F
|Resist Removal||DMSO-based remover (DuPont INTERVIA™ 2011 Remover)|
Immersion and agitation for 15 minutes at ambient temperature
15 µm Cu plated vias in 15 µm thick resist before and after resist removal