SU-8 3000

SU-8 3000 has been formulated for improved adhesion and reduced coating stress. It is being used where high bond strength and improved flexibility for microstructure fabrication is desired. As a result, adhesion to the substrate is greatly improved.

Material uses:

  • Waveguides
  • Microfluidics
  • Stamps

Material attributes:

  • Improved adhesion
  • Reduced coating stress
  • Vertical sidewalls
  • Greater than 100 μm film thickness in a single coat
  • Excellent dry etch resistance

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APPLICATIONS NOTES

10µm features in 50µm SU-8 3000 (contact expose)
Source: MicroChem