micro resist technology
Specialty Photoresists
Specialty Photoresists
mr-NIL212FC
Part of the Micro Resist Technology Line
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure sources
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
Data Sheet
Applications
- Soft UV-based NIL
- Etch mask for pattern transfer processes (dry and wet etching)
- Fabrication of nanostructures