StructSure™
Photoresists & Specialty Chemicals
Photoresists & Specialty Chemicals
TempKoat™ P Positive Temporary Photoresist
Part of the Kayaku Advanced Materials Line
TempKoat™ P is a chemically amplified, positive-tone resist series for advanced packaging and MEMS applications.
TempKoat™ P 20 is the first dilution available in the TempKoat™ P series.
Material Attributes:
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Material Uses:
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Lithography Process for TempKoat™ P 20
| Substrate | 150 mm Cu wafer |
| Spin Speed | 2000 rpm/30 seconds |
| Film Thickness | 20 µm |
| Soft Bake | 120°C, 3 minutes (hot plate) |
| EBR | ~ 1.5 mm removal with EBR PG
500 rpm, 30 second + 65˚C for 1 minute (hot plate) |
| Exposure | 350 mJ/cm2
ABM Broadband aligner with 360 nm long pass filter Intensity measured at 365 nm |
| PEB | 95°C, 2 minutes |
| Development | Spray develop with 0.26N TMAH Developer 4 x 60 seconds puddle |
20 µm L/S in 20 µm thick resist
5 µm vias in 20 µm thick resist
Cu Plating Process for TempKoat™ P 20
| Surface Prep. | O2 Plasma
80SCCM, 350W, 3 minutes |
| Technic Elevate® Cu 6300 Cleaner (or equivalent)
room temperature, 1.5 minutes, shaker table |
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| Plating | Technic Elevate® Cu 6388
I = 0.83A, 16.67 minutes, 80˚F |
| Resist Removal | NMP-based remover (Remover PG)
Immersion and agitation for 15 minutes at ambient |
100 µm Cu posts plated to 20 µm
before resist removal
100 µm Cu posts plated to 20 µm
after resist removal
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20 µm plated Cu L/S in 32 µm thick resist
FEATURED APPLICATIONS