TempKoat™ P is a chemically amplified, positive-tone resist series for advanced packaging and MEMS applications.
TempKoat™ P 20 is the first dilution available in the TempKoat™ P series.
Material Attributes:
| Material Uses:
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Lithography Process for TempKoat™ P 20
Substrate | 150 mm Cu wafer |
Spin Speed | 2000 rpm/30 seconds |
Film Thickness | 20 µm |
Soft Bake | 120°C, 3 minutes (hot plate) |
EBR | ~ 1.5 mm removal with EBR PG 500 rpm, 30 second + 65˚C for 1 minute (hot plate) |
Exposure | 350 mJ/cm2 ABM Broadband aligner with 360 nm long pass filter Intensity measured at 365 nm |
PEB | 95°C, 2 minutes |
Development | Spray develop with 0.26N TMAH Developer 4 x 60 seconds puddle |


Cu Plating Process for TempKoat™ P 20
Surface Prep. | O2 Plasma 80SCCM, 350W, 3 minutes |
Technic Elevate® Cu 6300 Cleaner (or equivalent) room temperature, 1.5 minutes, shaker table | |
Plating | Technic Elevate® Cu 6388 I = 0.83A, 16.67 minutes, 80˚F |
Resist Removal | NMP-based remover (Remover PG) Immersion and agitation for 15 minutes at ambient |

before resist removal

after resist removal