Products by Applications
Advanced Packaging
- Dielectric Layer
- ~ 3-10 µm film thickness
- No warpage due to low shrinkage and low tensile modulus
- Solvent-developable in Cyclopentanone
- i-Line/broadband sensitivity, 1:1 aspect ratio imaging
- Low temperature cure < 200°C
- Good electrical properties
- Low moisture uptake
- High thermal and chemical stability
- EBR PG
- KMSF® Developer
- Stress buffer
- Passivation and protective layer
- Negative tone, photoimageable dielectric
- 5 to 10 µm film thickness after cure
- Solvent-developable in PGMEA
- i-Line/broadband sensitivity, 1:1 aspect ratio imaging
- Low temperature cure ≤ 200°C
- Low Dk/Df electrical properties
- Low moisture uptake
- Good thermal and chemical stability
- EBR PG
- SU-8 Developer
- RDL
- Passivation and protective layer
- Wafer level packaging
- Electrodeposition
- Coating thickness capability from 2-10 µm
- Provides uniform, defect free coating
- Exposure at i-Line (365-405) wavelength
- DuPont Developers
- DuPont Removers
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
- DuPont Developers
- DuPont Removers
- Plating
- 10 to 40 µm film thickness in a single coat
- i-Line/broadband sensitivity, 3:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent chemical resistance and residue-free removal
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- MicroChem 303 A Developer
- Remover PG
- Electroplating
- RDL
- Microbumping
- 7 to 20 µm film thickness in a single coat
- i-Line/broadband sensitivity, 2:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent resistance to copper plating chemistries
- Residue-free removal
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- INTERVIA™ 2011 Remover
- Remover PG
- Electroplating
- RDL
- Microbumping
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
- Plating: Thick positive resists
- Microlenses
III-Vs, Optoelectronics
- Airbridges
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Dielectric Layers
- Excellent resolution
- Excellent chemical resistance, electrical, thermal, and mechanical properties
- Wide processing windows
- DuPont Developers
- Low moisture absorption
- Low temperature cure
- Excellent planarization
- Primers
- DuPont Developers
- i-line, g-line, and broadband-sensitive
- Excellent dielectric properties
- No interaction with common lithography solvents
- Primers
- DuPont Developers
- Microlenses
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Micro & nano components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
- Plating: Thick positive resists
- Microlenses
- Passivation
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- T-gates
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
- Waveguides
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- UV patterning of core and cladding
- High transmittance @ 850 nm
- High heat and pressure resistance
- OrmoDev
- OrmoPrime®08
- OrmoThin
- UV patterning (lithography/moulding)
- Exposure: i-line, broadband
- Thermally stable up to 270°C
- Low optical loss
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Wafer Thinning
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
MEMS
- C-MEMS, C-NEMS
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- Cantilevers
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- DRIE
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- Direct Write Laser Lithography
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Sensitive above 400 nm, for direct writing laser @ 405 nm
- High thermal and chemical stability
- High wet and dry etch stability
- MRT Removers
- Remover PG
- mr-Dev 600
- Direct Writing Lithography
- Film thickness from 1 µm up to 60 µm and higher
- High intensity laser exposure possible without out-gassing
- 50-60 µm depth range of patterns
- MRT Developers
- Remover PG
- MF-26A Developer
- MRT Removers
- Grayscale
- LIGA
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Micro Molds and Stamps
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Microfluidics
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Microwell Arrays
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- Surface Modification
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Wafer Bonding
- Low temperature processing (< 200°C)
- High quality, void free bonding
- i-line exposure
- Superb adhesion to silicon and glass
- EBR-PG
- PN 1000 Developer
- Permanent Wafer Bonding
Optical Components
- Micro & Nano Components
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Micro & nano components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Waveguides
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
- SU-8 Developer
- Remover PG
- EBR-PG
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- UV patterning of core and cladding
- High transmittance @ 850 nm
- High heat and pressure resistance
- OrmoDev
- OrmoPrime®08
- OrmoThin
- UV patterning (lithography/moulding)
- Exposure: i-line, broadband
- Thermally stable up to 270°C
- Low optical loss
- OrmoDev
- OrmoPrime®08
- OrmoThin
Display
- Dielectric layers
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Electrowetting (pixel grids)
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
General Lithography
- Bi-Layer Lift-off
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges
- 1 to 5 µm film thickness range
- i-Line/Broadband sensitivity, 1:1 aspect ratio capability
- Adjustable sidewall profile angle
- Aqueous alkaline development (standard 0.26N TMAH developers)
- Pattern thermal stability up to 200°C
- Clean removal
- EBR PG
- CD-26 Developer
- MF-319 Developer
- Remover PG
- INTERVIA™ 2011 Remover
- Single-layer Lift-off
- Bi-layer Lift-off
- Deposition patterning of insulator layers
- Sub-micron lift-off capability
- Compatible with g-, h-, and i-Line and 193 nm photoresists
- Excellent adhesion to thin film head and semiconductor substrates
- DuPont Developers
- Remover 1165
- Bi layer lift-off
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- Cellosolve™ acetate and xylene-free
- Excellent adhesion and coating uniformity
- Optimized for g-Line exposure
- MCC Developers
- Remover PG
- Remover 1112A
- MF-319 Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- MicroChem 303A Developer
- MicroChem 452 Developer
- MicroChem 455 Developer
- Bi layer lift-off
- Wet etch
- Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
- Contact holes on oxide
- Fast photospeed
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- MF-26A Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- Bi layer lift-off
- High resolution i-Line
- Dry Etch
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- Glycol ether- and xylene-free solvent system
- Excellent adhesion
- Superior coating uniformity
- Remover PG
- Remover 1112A
- MF-26A Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- Dry etch
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- E-beam Lithography
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
- E-beam Lithography
- Negative DUV/e-beam
- Electrodeposition
- Coating thickness capability from 2-10 µm
- Provides uniform, defect free coating
- Exposure at i-Line (365-405) wavelength
- DuPont Developers
- DuPont Removers
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
- DuPont Developers
- DuPont Removers
- Grayscale
- Film thickness from 1 µm up to 60 µm and higher
- High intensity laser exposure possible without out-gassing
- 50-60 µm depth range of patterns
- MRT Developers
- Remover PG
- MF-26A Developer
- MRT Removers
- Grayscale
- High Resolution i-Line
- Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
- Contact holes on oxide
- Fast photospeed
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- MF-26A Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- Bi layer lift-off
- High resolution i-Line
- Broadband, g-Line and i-Line capable
- Thermal stability ≥125°C
- Compatible across a wide variety of developer families
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- High resolution i-Line
- Negative DUV/e-beam
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
- E-beam Lithography
- Negative DUV/e-beam
- Negative DUV Resists
- Low iso-dense bias
- Maximum isolated film retention to <110 nm
- Compatible with PSM & OPC assist features to enlarge process windows
- CD-26 Developer
- MF-26 Developer
- Remover 1165
- 150 -180 nm nodes high etch resistance
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
- E-beam Lithography
- Negative DUV/e-beam
- Plating: Thick Negative Resists
- 7 to 20 µm film thickness in a single coat
- i-Line/broadband sensitivity, 2:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent resistance to copper plating chemistries
- Residue-free removal
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- INTERVIA™ 2011 Remover
- Remover PG
- Electroplating
- RDL
- Microbumping
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
- Single-spin film thickness >100 microns
- Near vertical side walls
- Excellent adhesion to all WLP substrates; excellent chemical resistance.
- DuPont Developers
- DuPont Removers
- Plating: Thick negative resists
- Plating: Thick Positive Resists
- 10 to 40 µm film thickness in a single coat
- i-Line/broadband sensitivity, 3:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent chemical resistance and residue-free removal
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- MicroChem 303 A Developer
- Remover PG
- Electroplating
- RDL
- Microbumping
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
- Plating: Thick positive resists
- Microlenses
- Positive DUV Resists
- Superior etch resistance
- Wide process window
- 150° thermal stability
- MF® CD-26 Developer
- EBR-10A Edge Bead Remover
- Remover 1165
- Positive DUV Resists
- Low viscosity allows for reduced dispense volume
- Improved coating uniformity for films ranging from 1.1 µm to 3.0 µm
- 150°C thermal stability
- MF® CD-26 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- Positive DUV Resists
- Low iso-dense bias
- Maximum isolated film retention to <110 nm
- Compatible with PSM & OPC assist features to enlarge process windows
- AR 3 BARC
- CD-26 Developer
- MF-26 Developer
- Remover 1165
- 130 nm device node
- Compatible with a wide range of substrates including silicon and both organic and inorganic antireflective materials
- 150°C thermal stability
- MF® CD-26 Developer
- EBR-10A Edge Bead Remover
- Remover 1165
- Positive DUV Resists
- Single Layer Lift-Off
- 1 to 5 µm film thickness range
- i-Line/Broadband sensitivity, 1:1 aspect ratio capability
- Adjustable sidewall profile angle
- Aqueous alkaline development (standard 0.26N TMAH developers)
- Pattern thermal stability up to 200°C
- Clean removal
- EBR PG
- CD-26 Developer
- MF-319 Developer
- Remover PG
- INTERVIA™ 2011 Remover
- Single-layer Lift-off
- Bi-layer Lift-off
- Deposition patterning of insulator layers
- High wet and dry etch resistance
- Good thermal stability of the resist pattern
- Tunable pattern profile: vertical to undercut
- MRT Developers
- Remover PG
- MRT Removers
- Single layer lift-off
- Wet Etch
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
- Cellosolve™ acetate and xylene-free
- Excellent adhesion and coating uniformity
- Optimized for g-Line exposure
- MCC Developers
- Remover PG
- Remover 1112A
- MF-319 Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- MicroChem 303A Developer
- MicroChem 452 Developer
- MicroChem 455 Developer
- Bi layer lift-off
- Wet etch
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
Nanoimprint Lithography
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Micro & nano components
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Excellent film quality on various substrate materials
- Very low residual layer thickness < 10 nm
- Excellent pattern transfer fidelity
- Thermal NIL
- Pattern Transfer
- UV-based
- NIL Pattern transfer
- Increased dry etching resistance in demanding plasma processes
- Excellent reproducibility enabling high volume production
- Film thickness adjustable from sub 100 nm range up to several microns
- UV-based NIL
- Pattern Transfer
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure sources
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
- Soft UV-based NIL
- Etch mask for pattern transfer processes (dry and wet etching)
- Fabrication of nanostructures
- Very low release forces
- Excellent wetting properties
- Fast curing, high resolution
- mr-APS1 Adhesion Promoter
- ma-T 1050 Thinner
- UV-based NIL
- Pattern Transfer
- Micro/nano high aspect ratio patterning
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
- UV-based NIL
- Pattern Transfer
- Permanent Applications
- Mold Replication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Pattern Transfer
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Excellent film quality on various substrate materials
- Very low residual layer thickness < 10 nm
- Excellent pattern transfer fidelity
- Thermal NIL
- Pattern Transfer
- UV-based
- NIL Pattern transfer
- Increased dry etching resistance in demanding plasma processes
- Excellent reproducibility enabling high volume production
- Film thickness adjustable from sub 100 nm range up to several microns
- UV-based NIL
- Pattern Transfer
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure sources
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
- Soft UV-based NIL
- Etch mask for pattern transfer processes (dry and wet etching)
- Fabrication of nanostructures
- Very low release forces
- Excellent wetting properties
- Fast curing, high resolution
- mr-APS1 Adhesion Promoter
- ma-T 1050 Thinner
- UV-based NIL
- Pattern Transfer
- Micro/nano high aspect ratio patterning
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
- UV-based NIL
- Pattern Transfer
- Permanent Applications
- Permanent Applications
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Micro & nano components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
- OrmoDev
- OrmoPrime®08
- OrmoThin
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
- UV-based NIL
- Pattern Transfer
- Permanent Applications
- Excellent properties for thermal NIL
- Longer life-time of anti-sticking layers on the mold
- High plasma etch resistance
- Thermal NIL
- Pattern Transfer
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
- Thermal NIL
- Pattern Transfer
- Permanent Applications
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Excellent flowability
- Superior demolding characteristics
- Imprints can be performed at moderate temperatures in the range of 110 – 140°C.
- Thermal NIL
- Pattern Transfer
- Pattern Transfer
- Excellent properties for thermal NIL
- Longer life-time of anti-sticking layers on the mold
- High plasma etch resistance
- Thermal NIL
- Pattern Transfer
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
- Thermal NIL
- Pattern Transfer
- Permanent Applications
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
- Excellent flowability
- Superior demolding characteristics
- Imprints can be performed at moderate temperatures in the range of 110 – 140°C.
- Thermal NIL
- Pattern Transfer
- Permanent Applications
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
- Thermal NIL
- Pattern Transfer
- Permanent Applications
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
- Thermal NIL
- Lab-on-chip systems
Functional Printed Electronic Materials
- Circuit & Electromechanical Assemblies
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- Component or wire attachment
- Filling via holes or spaces
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
- Potting components or assemblies
- Protection against moisture
- Protection against thermal or mechanical shock
- Excellent moisture resistance
- Excellent toughness and flexibility
- Fast curing
- Excellent mechanical properties and heat resistance
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
- EL Panel and LED Lighting
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- Capacitance layer between phosphor and back electrodes for EL lamps on polyester or ITO substrates
- Rigid thermal dielectric
- Electrically insulating
- Very moisture resistant
- Produces mirror smooth surface finish
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
- For use as a capacitance layer in EL Applications
- Blend with phosphor powder for customer blended ink
- Excellent flexibility electrical insulation
- Maintains high dielectric constant for optimal EL lamp performance
- Outstanding adhesion to ITO surfaces
- Inkjet Printing
- Low viscosity (solvent-ratio dependent)
- Compatible to standard ink-jet printing devices
- Excellent thermal, mechanical, and chemical stability of cured patterns
- Inkjet printing
- Medical Devices
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
- Silver to silver chloride ratios can be adjusted
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
- 50/50 blend
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
- 65/35 blend
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
- Printed visual references for X-ray, MRI, CT or other imaging equipment
- Smooth finish
- Can be colored
- Fast drying
- Screen, gravure, flexographic
- Can apply by brush or syringe
- Compatible with Parylene overcoats
- Visual reference tags for use with devices exposed to X-ray and other imaging technologies
- Smooth finish printing
- Gray color
- Can be applied by screen, high speed roll printing processes, coating, dipping, and manual processing (for prototypes)
- Membrane Switches
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- Membrane switches
- Overprint for silver conductive traces
- Flex circuits
- Additive circuits
- In-mold electronics
- Highly conductive
- Screen print, spray, dip or coat
- Excellent adhesion to metal, polyester & polyimide substrates
- Can be blended with AG-800 for specific resistance values
- Can be used as base electrode for EL panels
- Component or wire attachment
- Filling via holes or spaces
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
- Printed Heaters & Thermal Targets
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- Membrane switches
- Overprint for silver conductive traces
- Flex circuits
- Additive circuits
- In-mold electronics
- Highly conductive
- Screen print, spray, dip or coat
- Excellent adhesion to metal, polyester & polyimide substrates
- Can be blended with AG-800 for specific resistance values
- Can be used as base electrode for EL panels
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
- RFID and Cell Phone Antennas
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- RFID tags
- Cell phone antennas
- Medical EEG/EKG sensors
- EMI/RFI shielding
- Gravure or high speed processes
- Suitable for spray, dipping or coating
- Low viscosity, high solids silver ink
- Electrically conductive
- Can be cross linked
- Solar Panels
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
- Component or wire attachment
- Filling via holes or spaces
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- Surface Mount Component Attachment
- Component or wire attachment
- Filling via holes or spaces
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- Touch Screens
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Component or wire attachment
- Filling via holes or spaces
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
- Component encapsulation
- Printed circuit board protection
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Dielectric Layer Learn More
KMSF® 1000 Low Stress Photo-dielectric
Negative-tone, ultra-low stress photo-patternable dielectric for wafer level packaging.
Data Sheet
Ancillaries
Applications
KMSF® 2000 Low Dk/Df Photo-dielectric
Negative-tone, low temperature cure, low Dk/Df photo-patternable dielectric for wafer level Packaging.
Data Sheet
Ancillaries
Applications
Electrodeposition Learn More
InterVia™ 3D-P Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.
Data sheet:
Ancillaries:
Application:
InterVia™ 3D-N Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.
Data sheet:
Ancillaries:
Application:
Plating Learn More
TempKoat™ P 20 Thick Positive Resist
Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.
Data Sheet
Ancillaries
Applications
TempKoat™ N 15 Negative Temporary Photoresist
Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.
Data Sheet
Ancillaries
Applications
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
Data sheet:
Ancillaries:
Applications:
Airbridges Learn More
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
Dielectric Layers
InterVia™ 8023 Dielectrics
For advanced packaging applications:
The InterVia 8023 Series photodielectrics are spin-on deposited, negative tone, TMAH(aq) developable and curable at low temperatures.
Data sheet:
Ancillaries:
Application:
Cyclotene 3000 Dielectrics
Advanced electronic dielectric materials for microelectronic device fabrication.
Data sheet:
Ancillaries:
Application:
Cyclotene 4000 Dielectrics
Advanced electronic resins developed for use as photoimageable dielectrics in thin film microelectronics applications.
Ancillaries:
Application:
Microlenses Learn More
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
Data sheets:
Ancillaries:
Applications:
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
Data sheet:
Ancillaries:
Applications:
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
Data sheet:
Ancillaries:
Applications:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
Data sheet:
Ancillaries:
Applications:
Passivation Learn More
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
T-gates Learn More
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
Data sheets:
Ancillaries:
Applications:
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
Waveguides Learn More
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
EpoCore/Clad Polymers for Waveguide Fabrication
Resist system for laminated waveguides
Data sheet:
Ancillaries:
Application:
OrmoCore/Clad Photo Patterning Hybrid Polymers
ORMOCER® System for Planar Optical Waveguides
Data sheet:
Ancillaries:
Application:
Hybrid polymers based on ORMOCER®s for micro-optics licensed by the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.
Wafer Thinning Learn More
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
C-MEMS, C-NEMS Learn More
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
Data Sheet:
Applications:
Cantilevers Learn More
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
Data sheets:
Ancillaries:
Applications:
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
Data Sheet:
Applications:
DRIE Learn More
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
Direct Write Laser Lithography
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
mr-DWL Series
Negative resists for direct laser writing @ 405 nm
Data sheet:
Ancillaries:
Application:
ma-P 1200G Positive Resist Series for Grayscale Lithography
Thick positive photoresist designed for the requirements of grayscale lithography
Data sheet:
Ancillaries:
Application:
LIGA Learn More
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
Micro Molds and Stamps Learn More
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
Data sheet:
Applications:
Microfluidics Learn More
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
Data sheet:
Ancillaries:
Applications:
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
Data sheet:
Applications:
Microwell Arrays Learn More
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
Data Sheet:
Applications:
Surface Modification Learn More
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
Wafer Bonding
PermiNex Photoimageable Bonding Adhesives
Negative tone, epoxy-based, photoimageable bonding resists used as a permanent adhesive layer for the definition and capping of cavity structures.
Data sheets:
Ancillaries:
Application:
Micro & Nano Components
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
Data Sheet:
Applications:
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
Data sheet:
Ancillaries:
Applications:
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
Data sheet:
Ancillaries:
Applications:
Waveguides
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
Data sheets:
Ancillaries:
Applications:
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
Data Sheet:
Applications:
EpoCore/Clad Polymers for Waveguide Fabrication
Resist system for laminated waveguides
Data sheet:
Ancillaries:
Application:
OrmoCore/Clad Photo Patterning Hybrid Polymers
ORMOCER® System for Planar Optical Waveguides
Data sheet:
Ancillaries:
Application:
Hybrid polymers based on ORMOCER®s for micro-optics licensed by the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.
Dielectric layers Learn More
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
Electrowetting (pixel grids) Learn More
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
Data sheets:
Ancillaries:
Bi-Layer Lift-off Learn More
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
Data sheets:
Ancillaries:
Applications:
UniLOR® N Single-layer Lift-off Photoresists
Negative-tone resists for lift-off processes.
Data Sheet
Ancillaries
Applications
LOL™ 1000 & 2000 Lift-off Layers
Enhanced dissolution rate, dyed PMGI solution used for lift-off processes requiring tight CD control.
Data sheet:
Ancillaries:
Application:
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
S1800® G2 Broadband Resists
Positive photoresists for advanced IC device fabrication.
Data sheet:
Ancillaries:
Applications:
SPR™ 955-CM High-resolution i-Line Resists
General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications
Data sheet:
Ancillaries:
Applications:
Dry Etch Learn More
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
SPR™3000 Series Broadband Resists
SPR™3000 Series Broadband Resists
Positive photoresist engineered for i-line, g-line, and broadband applications with high resolution, high throughput, and excellent process latitudes.
Data sheet:
Ancillaries:
Application:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
E-beam Lithography Learn More
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
Data sheet:
Ancillaries:
Applications:
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
Data sheet:
Ancillaries:
Applications:
Electrodeposition Learn More
InterVia™ 3D-P Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.
Data sheet:
Ancillaries:
Application:
InterVia™ 3D-N Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.
Data sheet:
Ancillaries:
Application:
Grayscale
ma-P 1200G Positive Resist Series for Grayscale Lithography
Thick positive photoresist designed for the requirements of grayscale lithography
Data sheet:
Ancillaries:
Application:
High Resolution i-Line Learn More
SPR™ 955-CM High-resolution i-Line Resists
General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications
Data sheet:
Ancillaries:
Applications:
SPR™3600M Advanced i-Line Resists
Dyed photoresist for extremely high throughput processing on reflective substrates.
Data sheet:
Ancillaries:
Application:
Negative DUV/e-beam
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
Data sheet:
Ancillaries:
Applications:
Negative DUV Resists Learn More
UVN® 30 Negative DUV Photoresist
An advanced resist for 130 nm design rules:
Data sheet:
Ancillaries:
Application:
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
Data sheet:
Ancillaries:
Applications:
Plating: Thick Negative Resists Learn More
TempKoat™ N 15 Negative Temporary Photoresist
Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.
Data Sheet
Ancillaries
Applications
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
Data sheet:
Ancillaries:
Applications:
BPR™-100 Thick Resists
Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)
Data sheet:
Ancillaries:
Application:
Plating: Thick Positive Resists Learn More
TempKoat™ P 20 Thick Positive Resist
Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.
Data Sheet
Ancillaries
Applications
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
Data sheet:
Ancillaries:
Applications:
Positive DUV Resists Learn More
UV6™ Positive DUV Resist
Optimized to provide vertical profile imaging of dense and semi-isolated features for device production design rules to 180 nm
Data sheet:
Ancillaries:
Application:
UV™26 Positive DUV Resist
Positive DUV photoresist developed for deep implant applications
Data sheet:
Ancillaries:
Application:
UV™135 Positive DUV Resist
An advanced resist for 130 nm design rules:
Data sheet:
Ancillaries:
Application:
UV™210GS Positive DUV Resist
Multipurpose resist that can be utilized for gate, phase shift mask contact holes, and trench applications in the 180-130 nm CD range
Data sheet:
Ancillaries:
Application:
Single Layer Lift-Off
UniLOR® N Single-layer Lift-off Photoresists
Negative-tone resists for lift-off processes.
Data Sheet
Ancillaries
Applications
ma-N 400 & ma-N 1400 Negative Resists
Conventional pattern transfer and single-layer lift-off for microelectronics and micro systems technology
Data sheet:
Ancillaries:
Application:
Wet Etch
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
Data sheet:
Ancillaries:
Applications:
S1800® G2 Broadband Resists
Positive photoresists for advanced IC device fabrication.
Data sheet:
Ancillaries:
Applications:
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
Data sheet:
Ancillaries:
Applications:
UV-based NIL:
UV-based NIL:
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
Data sheet:
Ancillaries:
Applications:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
mr-NIL 6000E UV-cure Resist for Thermal NIL
UV-curable material for permanent applications with isothermal processing
Data sheet:
Applications:
mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps
Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
Very low release forces
No adhesion promoter or primer necessary
No oxygen inhibition
Mask for pattern transfer processes (dry and wet etching)
Data Sheet
Applications:
mr-NIL210 Photo-curable Nanoimprint Resist
NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
Data sheet:
Applications:
mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
Data Sheet
Applications
mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist
NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.
Data sheet:
Ancillaries
Applications:
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
Data sheet:
Ancillaries:
Applications:
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
Data sheet:
Applications:
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
Data sheet:
Applications:
Mold Replication Learn More
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
Data sheet:
Applications:
Pattern Transfer Learn More
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
mr-NIL 6000E UV-cure Resist for Thermal NIL
UV-curable material for permanent applications with isothermal processing
Data sheet:
Applications:
mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps
Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
Very low release forces
No adhesion promoter or primer necessary
No oxygen inhibition
Mask for pattern transfer processes (dry and wet etching)
Data Sheet
Applications:
mr-NIL210 Photo-curable Nanoimprint Resist
NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
Data sheet:
Applications:
mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
Data Sheet
Applications
mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist
NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.
Data sheet:
Ancillaries
Applications:
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
Data sheet:
Applications:
Permanent Applications Learn More
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
Data sheet:
Ancillaries:
Applications:
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
Data sheet:
Ancillaries:
Applications:
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
Data sheet:
Applications:
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
Data sheet:
Applications:
Thermal NIL:
Thermal NIL:
mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL
Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns
Data sheet:
Applications:
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
Data sheet:
Applications:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer
Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns
Data sheet:
Applications:
Pattern Transfer Learn More
mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL
Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns
Data sheet:
Applications:
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
Data sheet:
Applications:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer
Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns
Data sheet:
Applications:
Permanent Applications Learn More
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
Data sheet:
Applications:
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
Data sheet:
Applications:
Circuit & Electromechanical Assemblies Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-515-1 Silver Conductive Ink
Applications:
Features:
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
Features:
Data Sheets
EP-799 Black Potting Compound
Volume Resistivity: < 1.0 x 1014 Ω-cm
Applications:
Features:
Data Sheets
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
Features:
Data Sheets
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
Features:
Data Sheets
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
Features:
Data Sheets
EL Panel and LED Lighting Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-510 Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
BT-101 Barium Titanate Dielectric
Volume Resistivity: > 1 x 1014 Ω-cm
Applications:
Features:
Data Sheets
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.
Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
Features:
Data Sheets
PH-745 Phosphor Binder
Surface Resistivity: 5.0 x 1015 Ω/square
Applications:
Features:
Data Sheets
Inkjet Printing
InkOrmo Jettable Hybrid Polymer
UV-curable hybrid polymer for ink-jet printing of optical micro patterns
Data sheet:
Application:
Medical Devices Learn More
AG-515-1 Silver Conductive Ink
Applications:
Features:
AGCL-675 Silver/Silver Chloride Ink
Applications:
Features:
Data Sheets
AGCL-1134 Silver/Silver Chloride Ink
Applications:
Features:
Data Sheets
AGCL-1194 Silver/Silver Chloride Ink
Applications:
Features:
Data Sheets
RO-593 Radio Opaque Ink
Surface Resistivity: 2.9 x 1013 Ω/square
Applications:
Features:
Data Sheets
RO-948 Radio Opaque Ink
Applications:
Features:
Data Sheets
Membrane Switches Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-515-1 Silver Conductive Ink
Applications:
Features:
AG-510 Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
C-250J Carbon Screenprint Ink
Surface Resistivity: < 5.0 Ω/square/mil
Applications:
Features:
Data sheets:
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.
Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
Features:
Data Sheets
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
Features:
Data Sheets
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
Features:
Data Sheets
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
Features:
Data Sheets
Printed Heaters & Thermal Targets Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-515-1 Silver Conductive Ink
Applications:
Features:
AG-510 Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
C-250J Carbon Screenprint Ink
Surface Resistivity: < 5.0 Ω/square/mil
Applications:
Features:
Data sheets:
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
Features:
Data Sheets
RFID and Cell Phone Antennas Learn More
AG-515-1 Silver Conductive Ink
Applications:
Features:
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
WB-1078 Water Based Silver Conductive Ink
Applications:
Features:
Data Sheets
Solar Panels Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-510 Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-800 Silver Conductive Ink
Applications:
Features:
Data Sheets
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
Features:
Data Sheets
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
Features:
Data Sheets
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
Features:
Data Sheets
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Surface Mount Component Attachment Learn More
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
Features:
Data Sheets
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Touch Screens Learn More
AG-500A Silver Conductive Ink
Applications:
Features:
Data Sheets
AG-510 Silver Conductive Ink
Applications:
Features:
Data Sheets
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.
Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
Features:
Data Sheets
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
Features:
Data Sheets
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
Features: