Technical References for MicroPlating

KMPR®, SU-8 and PMMA                                         

(MP-11-01) New method for dimensional precision control of electroformed parts by using micro electroforming technique with SU-8 thick photoresist
Liu, Chong (Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116024, China); Li, Miaomiao; Shi, Weizhi; Du, Liqun; Wang, Liding Jixie Gongcheng Xuebao
Journal of Mechanical Engineering, v 47, n 3, p 179-185, February 5, 2011 Language: Chinese

(MP-10-01) Direct e-beam writing of dense and high aspect ratio nanostructures in thick layers of PMMA for electroplating
Gorelick, Sergey (Paul Scherrer Institut, CH-5232 Villigen PSI, Switzerland); Guzenko, Vitaliy A.; Vila-Comamala, Joan; David, Christian
Nanotechnology, v 21, n 29, 2010

(MP-10-02) UV Lithography and Molding Fabrication of Ultrathick Micrometallic Structures Using a KMPR Photoresist
Young-Min Shin Gamzina, D. Barnett, L.R. Yaghmaie, F. Baig, A. Luhmann, N.C. Dept. of Appl. Sci., Univ. of California, Davis, CA, USA
Microelectromechanical Systems, Journal of; Issue: 3 683 – 689 June 2010
ISSN: 1057-7157 INSPEC Accession #: 11328179
DOI: 10.1109/JMEMS.2010.2045880 01 June 2010

(MP-10-03) Tri-Axis Receiver for Wireless Micro-Power Transmission
Nan-Chyuan Tsai, Sheng-Liang Hsu
International Conference on Mechanical and Industrial Engineering (ICMIE 2010), Aug 25-27, Singapore.

(MP-09-01) Moisture resistance of SU-8 and KMPR as structural material
V.M. Blanco Carballo *, J. Melai, C. Salm, J. Schmitz
MESA+, Institute for Nanotechnology, University of Twente, P.O. Box 217, Enschede 7500 AE, The Netherlands
Microelectronic Engineering 86 765–768, 2009

(MP-09-02) Design and fabrication of a microfluidic device for near-single cell mRNA isolation using a copper hot embossing master
S. R. Nugen, P. J. Asiello and A. J. Baeumner
Microsyst Tech 15(3):477-483 (2009)

(MP-08-03) Thick photoresists for electroforming metallic microcomponents
X Wei 1, C-H Lee 1, Z Jiang 2, K Jiang 1
1Department of Mechanical Engineering, University of Birmingham, Edgbaston, UK
2Institute of Precision Engineering, Xian Jiao Tong University, Xian, People’s Republic of China
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science vol. 222 no. 1 37-42, January 1, 2008

(MP-07-01) KMPR photoresist for fabrication of thick microstructures
Chen-Han Lee, Kyle Jiang
Centre for Microengineering and Nanotechnology, School of Engineering, the University of Birmingham, Edgbaston, Birmingham B15 2TT, UK
4M, 2007

(MP-07-02) Ultra High Aspect Ratio Plating and 3-D Air Bridges with KMPR Photoresist
Harris Miller, Microchem
IMAPS, 2007

(MP-06-01) Metal foundation construction to consolidate electroplated structures for successful removal of SU-8 mould
Cui, F.; Chen, W.-Y.; Zhao, X.-L.; Jing, X.-M.; Wu, X.-S.;
Electronics Letters, Volume: 42 , Issue: 12 Digital Object Identifier: 10.1049/el:20060751 , Page(s): 690 – 691 (2006)