DuPont
Electronic Materials
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InterVia™ Cu 8540

Part of the Dupont Line
Electronic Materials

Enhanced dissolution rate, dyed PMGI solution used for lift-off processes requiring tight CD control

  • Sub-micron lift-off capability
  • Compatible with g-, h-, and i-Line and 193 nm photoresists
  • Excellent adhesion to thin film head and semiconductor substrates

Ancillaries:

Applications:

  • Bi-layer Lift-off

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