Electronic Materials
InterVia™ 3D-N Electrophoretic Photoresists
Part of the Dupont LineNegative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
Ancillaries:
- DuPont Developers
- DuPont Removers
Applications:
- General Lithography: Electrodeposition
- Advanced Packaging: Electrodeposition
Kayaku Advanced Materials, Inc.’s distribution of DuPont Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.
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