Electronic Materials
Home 5 Product 5 InterVia™ 3D-N Electrophoretic Photoresists

InterVia™ 3D-N Electrophoretic Photoresists

Part of the Dupont Line
Electronic Materials

Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition

  • Coating thickness capability up to 12.5 microns
  • Provides uniform, defect free coating
  • Resolution capability of 1:1


  • DuPont Developers
  • DuPont Removers


  • General Lithography: Electrodeposition
  • Advanced Packaging: Electrodeposition

Kayaku Advanced Materials, Inc.’s distribution of DuPont Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.

Find additional DuPont materials for your applications.