Electronic Materials
INTERLINK™ 9200 Cu TSV
Part of the Dupont Line
INTERLINK™ 9200 Copper is designed for through-silicon via (TSV) plating with rapid via filling speeds and low wafer overburden. INTERLINK™ 9200 Copper is a three component organic additive system with a wide dosing window to enable process robustness, while minimizing post-plating CMP by reducing the amount of electroplated Cu on the wafer surface. Cu deposits from INTERLINK™ 9200 Copper are highly pure, preventing any voiding during annealing and allowing high performance devices. Long bath life and process stability is achieved with INTERLINK™ 9200 Copper, allowing uniform via filling speeds throughout the bath life.
Kayaku Advanced Materials, Inc.’s distribution of DuPont Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.
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