Electronic Materials
INTERLINK™ 9200 Cu TSV
Part of the Dupont LineINTERLINK™ 9200 Copper is designed for through-silicon via (TSV) plating with rapid via filling speeds and low wafer overburden. INTERLINK™ 9200 Copper is a three component organic additive system with a wide dosing window to enable process robustness, while minimizing post-plating CMP by reducing the amount of electroplated Cu on the wafer surface. Cu deposits from INTERLINK™ 9200 Copper are highly pure, preventing any voiding during annealing and allowing high performance devices. Long bath life and process stability is achieved with INTERLINK™ 9200 Copper, allowing uniform via filling speeds throughout the bath life.
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