Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)
- Single-spin film thickness >100 microns
- Near vertical side walls
- Excellent adhesion to all WLP substrates; excellent chemical resistance.
- DuPont Developers
- DuPont Removers
- Plating: Thick Negative Tone
Kayaku Advanced Materials, Inc.’s distribution of DuPont Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.
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