InterVia BPR™-100 Thick Photoresist

Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)

  • Single-spin film thickness >100 microns
  • Near vertical side walls
  • Excellent adhesion to all WLP substrates; excellent chemical resistance.


  • DuPont Developers
  • DuPont Removers


  • Plating: Thick Negative Tone

Kayaku Advanced Materials, Inc.’s distribution of DuPont Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.

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