KMRD-015A
KMRD-015A is a negative tone, low temperature cure polyamide photo-dielectric for redistribution and buffer layers. It is reactive to broadband and i-Line exposure systems, aqueous developed and compatible with industry standard edge bead removers and back-rinse solvents.
PermiNex®
is a negative tone, epoxy-based, photoimageable bonding resists used as a permanent adhesive layer for the definition and capping of cavity structures.
- Low temperature processing (< 200°C)
- High quality, void free bonding
- i-line exposure
- Superb adhesion to silicon and glass
LOR and PMGI
resists are based on polydimethylglutarimide. Its unique properties enable LOR and PMGI products to perform exceptionally well when used, either as a sacrificial layer, or as an undercut layer in bi-layer lift-off processing. LOR and PMGI resists are designed for applications requiring high resolution imaging, easy process tuning, high yields and superior deposition line width control. Mainstream applications utilizing LOR or PMGI resists include GMR & MR heads, wireless devices, opto-electronics, MEMs, and packaging.
Delivering Innovative Chemical Solutions
Kayaku Advanced Materials, Inc. is more than just a global supplier of specialty chemicals to the MEMS and Microelectronics industries. We are a diverse and experienced group of chemists, engineers, electronic materials technologists, and business professionals committed to finding photoresist technology solutions that enable our customers to achieve their technical and business goals.
We work in close cooperation with your engineering and quality organizations to advance the project through commercialization.
KMRD-015A
KMRD-015A is a negative tone, low temperature cure polyamide photo-dielectric for redistribution and buffer layers. It is reactive to broadband and i-Line exposure systems, aqueous developed and compatible with industry standard edge bead removers and back-rinse solvents.
PermiNex®
is a negative tone, epoxy-based, photoimageable bonding resists used as a permanent adhesive layer for the definition and capping of cavity structures.
- Low temperature processing (< 200°C)
- High quality, void free bonding
- i-line exposure
- Superb adhesion to silicon and glass
LOR and PMGI
resists are based on polydimethylglutarimide. Its unique properties enable LOR and PMGI products to perform exceptionally well when used, either as a sacrificial layer, or as an undercut layer in bi-layer lift-off processing. LOR and PMGI resists are designed for applications requiring high resolution imaging, easy process tuning, high yields and superior deposition line width control. Mainstream applications utilizing LOR or PMGI resists include GMR & MR heads, wireless devices, opto-electronics, MEMs, and packaging.