Thermoplastic polymers with built-in mold release properties
Nanoimprint Lithography Resists
- Thermoplastic and photo-curable materials for thermal and photo-NIL
mr-I 9000M
Thermoset material for thermal-NIL
mr-I PMMA
Thermoplastic polymer for basic nanoimprint lithography investigations
mr-I T85
Thermoplastic polymer especially suited for lab-on-chip applications
mr-NIL 6000E
UV curable material for isothermal imprint processing with outstanding pattern stability
mr-NIL200
Next generation UV-NIL resist for industrial manufacturing of micro and nano patterns
mr-NIL210
UV curable imprint resist with excellent compatibility to soft PDMS stamps
mr-NIL212FC
UV-curable resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance
mr-XNIL26SF
Solvent Free Photo-Curable Nanoimprint Resist
mr-UVCur26SF
UV curable resist formulation applicable by inkjet and suitable for R2R processes
SIPOL
Si-containing thermoplastic polymer for high-aspect ratio patterning