PermiNex® 1000 and 2000 Wafer Bonding Adhesives
Part of the StructSure® Line
Kayaku Advanced Materials, Inc. PermiNex 1000 and 2000 resists are epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.
Resolution Capability
5μm features in 15μm thick PermiNex® 1000
Source: Kayaku Advanced Materials
Source: Kayaku Advanced Materials
Overall Process Flow
Bonding Capability
Test Cavity Structures
- High seal integrity after bonding
- High edge acuity
- No cracking or defects at corners
- Void free, conformal interface
Adhesive Cavity Wall
Si to Glass bonded wafers, 10μm thick
PermiNex® adhesive structure
Source: Kayaku Advanced Materials
PermiNex® adhesive structure
Source: Kayaku Advanced Materials
Key Features
- Negative tone, photo-imageable adhesives
- Alkaline and solvent developable series
- High resolution patterning
- Low temperature processing (< 200°C)
- High quality, void-free bonding
- Superb adhesion to silicon and glass
- Good process compatibility (dicing, soldering) and high reliability (HAST, TCT)