2020
(DL-20-01) Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging
K. Han, J. Cordero, D. Nawrocki – Kayaku Advanced Materials, Inc.
S. Inagaki, Y. Akatsuka – Nippon Kayaku Corp.
2020 IEEE 70th Electronic components and Technology Conference (ECTC) – Orlando, FL, June 3-30 2020