Products By Application
- Dielectric Layer
-
KMSF® 1000 Low Stress Photo-dielectric
Negative-tone, ultra-low stress photo-patternable dielectric for wafer level packaging.
- ~ 3-10 µm film thickness
- No warpage due to low shrinkage and low tensile modulus
- Solvent-developable in Cyclopentanone
- i-Line/broadband sensitivity, 1:1 aspect ratio imaging
- Low temperature cure < 200°C
- Good electrical properties
- Low moisture uptake
- High thermal and chemical stability
Data Sheet
Ancillaries
- EBR PG
- KMSF® Developer
Applications
- Stress buffer
- Passivation and protective layer
-
KMSF® 2000 Low Dk/Df Photo-dielectric
Negative-tone, low temperature cure, low Dk/Df photo-patternable dielectric for wafer level Packaging.
- Negative tone, photoimageable dielectric
- 5 to 10 µm film thickness after cure
- Solvent-developable in PGMEA
- i-Line/broadband sensitivity, 1:1 aspect ratio imaging
- Low temperature cure ≤ 200°C
- Low Dk/Df electrical properties
- Low moisture uptake
- Good thermal and chemical stability
Data Sheet
Ancillaries
- EBR PG
- SU-8 Developer
Applications
- RDL
- Passivation and protective layer
- Wafer level packaging
- Electrodeposition
-
InterVia™ 3D-P Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.
- Coating thickness capability from 2-10 µm
- Provides uniform, defect free coating
- Exposure at i-Line (365-405) wavelength
Data sheet:
Ancillaries:
- DuPont Developers
- DuPont Removers
Application:
-
InterVia™ 3D-N Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
Data sheet:
Ancillaries:
- DuPont Developers
- DuPont Removers
Application:
- Plating
-
TempKoat™ P 20 Thick Positive Resist
Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.
- 10 to 40 µm film thickness in a single coat
- i-Line/broadband sensitivity, 3:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent chemical resistance and residue-free removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- MicroChem 303 A Developer
- Remover PG
Applications
- Electroplating
- RDL
- Microbumping
-
TempKoat™ N 15 Negative Temporary Photoresist
Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.
- 7 to 20 µm film thickness in a single coat
- i-Line/broadband sensitivity, 2:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent resistance to copper plating chemistries
- Residue-free removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- INTERVIA™ 2011 Remover
- Remover PG
Applications
- Electroplating
- RDL
- Microbumping
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
-
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
Data sheet:
Ancillaries:
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
Applications:
- Plating: Thick positive resists
- Microlenses
Dielectric Layer Learn More
Electrodeposition Learn More
Plating Learn More
- Airbridges
-
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Data sheets:
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Dielectric Layers
-
InterVia™ 8023 Dielectrics
For advanced packaging applications:
The InterVia 8023 Series photodielectrics are spin-on deposited, negative tone, TMAH(aq) developable and curable at low temperatures.
- Excellent resolution
- Excellent chemical resistance, electrical, thermal, and mechanical properties
- Wide processing windows
Data sheet:
Ancillaries:
- DuPont Developers
Application:
-
Cyclotene 3000 Dielectrics
Advanced electronic dielectric materials for microelectronic device fabrication.
- Low moisture absorption
- Low temperature cure
- Excellent planarization
Data sheet:
Ancillaries:
- Primers
- DuPont Developers
Application:
-
Cyclotene 4000 Dielectrics
Advanced electronic resins developed for use as photoimageable dielectrics in thin film microelectronics applications.
- i-line, g-line, and broadband-sensitive
- Excellent dielectric properties
- No interaction with common lithography solvents
Ancillaries:
- Primers
- DuPont Developers
Application:
- Microlenses
-
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Data sheets:
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Micro & nano components
-
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
-
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
Data sheet:
Ancillaries:
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
Applications:
- Plating: Thick positive resists
- Microlenses
- Passivation
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- T-gates
-
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Data sheets:
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- Waveguides
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
EpoCore/Clad Polymers for Waveguide Fabrication
Resist system for laminated waveguides
- UV patterning of core and cladding
- High transmittance @ 850 nm
- High heat and pressure resistance
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Application:
-
OrmoCore/Clad Photo Patterning Hybrid Polymers
ORMOCER® System for Planar Optical Waveguides
- UV patterning (lithography/moulding)
- Exposure: i-line, broadband
- Thermally stable up to 270°C
- Low optical loss
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Application:
Hybrid polymers based on ORMOCER®s for micro-optics licensed by the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.
- Wafer Thinning
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
Airbridges Learn More
Dielectric Layers
Microlenses Learn More
Passivation Learn More
T-gates Learn More
Waveguides Learn More
Wafer Thinning Learn More
- C-MEMS, C-NEMS
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
Data Sheet:
Applications:
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- Cantilevers
-
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Data sheets:
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
Data Sheet:
Applications:
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- DRIE
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- Direct Write Laser Lithography
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
mr-DWL Series
Negative resists for direct laser writing @ 405 nm
- Sensitive above 400 nm, for direct writing laser @ 405 nm
- High thermal and chemical stability
- High wet and dry etch stability
Data sheet:
Ancillaries:
- MRT Removers
- Remover PG
- mr-Dev 600
Application:
- Direct Writing Lithography
-
ma-P 1200G Positive Resist Series for Grayscale Lithography
Thick positive photoresist designed for the requirements of grayscale lithography
- Film thickness from 1 µm up to 60 µm and higher
- High intensity laser exposure possible without out-gassing
- 50-60 µm depth range of patterns
Data sheet:
Ancillaries:
- MRT Developers
- Remover PG
- MF-26A Developer
- MRT Removers
Application:
- Grayscale
- LIGA
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
- Micro Molds and Stamps
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
Data sheet:
Applications:
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Microfluidics
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
-
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
Data sheet:
Applications:
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Microwell Arrays
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
-
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
Data Sheet:
Applications:
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
- Surface Modification
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Wafer Bonding
-
PermiNex Photoimageable Bonding Adhesives
Negative tone, epoxy-based, photoimageable bonding resists used as a permanent adhesive layer for the definition and capping of cavity structures.
- Low temperature processing (< 200°C)
- High quality, void free bonding
- i-line exposure
- Superb adhesion to silicon and glass
Data sheets:
Ancillaries:
- EBR-PG
- PN 1000 Developer
Application:
- Permanent Wafer Bonding
C-MEMS, C-NEMS Learn More
Cantilevers Learn More
DRIE Learn More
Direct Write Laser Lithography
LIGA Learn More
Micro Molds and Stamps Learn More
Microfluidics Learn More
Microwell Arrays Learn More
Surface Modification Learn More
Wafer Bonding
- Micro & Nano Components
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
Data Sheet:
Applications:
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
-
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Micro & nano components
-
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
- Waveguides
-
SU-8 Permanent Negative Epoxy Resists
High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.
- Film thickness: 1-200 µm
- High aspect ratio imaging with near vertical side walls
- Near UV (350-400nm) processing
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- EBR-PG
Applications:
-
SU-8 TF 6000 Negative Resist
SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.
- Photo-imageable thin films with high resolution i-line patterning capability
- Broadband, i-line, g-line and h-line sensitivity
- Low temperature cure (< 150°C)
- Highly uniform thin films
Data Sheet:
Applications:
- Cantilevers
- C-MEMS, C-Nems
- Micro Molds & Stamps
- DRIE
- Micro & Nano Components
- Microwell Arrays
- Waveguides
-
EpoCore/Clad Polymers for Waveguide Fabrication
Resist system for laminated waveguides
- UV patterning of core and cladding
- High transmittance @ 850 nm
- High heat and pressure resistance
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Application:
-
OrmoCore/Clad Photo Patterning Hybrid Polymers
ORMOCER® System for Planar Optical Waveguides
- UV patterning (lithography/moulding)
- Exposure: i-line, broadband
- Thermally stable up to 270°C
- Low optical loss
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Application:
Hybrid polymers based on ORMOCER®s for micro-optics licensed by the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.
Micro & Nano Components
Waveguides
- Dielectric layers
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
- Electrowetting (pixel grids)
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SU-8 2000 Permanent Negative Epoxy Resists
Chemically amplified, i-Line resists, well-suited for the fabrication of permanent device structures
- Film thickness: <1-100 µm
- >10:1 aspect ratio
- Faster drying
Data sheets:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Dielectric layers Learn More
Electrowetting (pixel grids) Learn More
- Bi-Layer Lift-off
-
PMGI/LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190°C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Data sheets:
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
UniLOR® N Single-layer Lift-off Photoresists
Negative-tone resists for lift-off processes.
- 1 to 5 µm film thickness range
- i-Line/Broadband sensitivity, 1:1 aspect ratio capability
- Adjustable sidewall profile angle
- Aqueous alkaline development (standard 0.26N TMAH developers)
- Pattern thermal stability up to 200°C
- Clean removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-319 Developer
- Remover PG
- INTERVIA™ 2011 Remover
Applications
- Single-layer Lift-off
- Bi-layer Lift-off
- Deposition patterning of insulator layers
-
LOL™ 1000 & 2000 Lift-off Layers
Enhanced dissolution rate, dyed PMGI solution used for lift-off processes requiring tight CD control.
- Sub-micron lift-off capability
- Compatible with g-, h-, and i-Line and 193 nm photoresists
- Excellent adhesion to thin film head and semiconductor substrates
Data sheet:
Ancillaries:
- DuPont Developers
- Remover 1165
Application:
- Bi layer lift-off
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
S1800® G2 Broadband Resists
Positive photoresists for advanced IC device fabrication.
- Cellosolve™ acetate and xylene-free
- Excellent adhesion and coating uniformity
- Optimized for g-Line exposure
Data sheet:
Ancillaries:
- MCC Developers
- Remover PG
- Remover 1112A
- MF-319 Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- MicroChem 303A Developer
- MicroChem 452 Developer
- MicroChem 455 Developer
Applications:
- Bi layer lift-off
- Wet etch
-
SPR™ 955-CM High-resolution i-Line Resists
General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications
- Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
- Contact holes on oxide
- Fast photospeed
Data sheet:
Ancillaries:
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- MF-26A Developer
- Remover 1165
- EBR-10A Edge Bead Remover
Applications:
- Bi layer lift-off
- High resolution i-Line
- Dry Etch
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
SPR™3000 Series Broadband Resists
SPR™3000 Series Broadband Resists
Positive photoresist engineered for i-line, g-line, and broadband applications with high resolution, high throughput, and excellent process latitudes.
- Glycol ether- and xylene-free solvent system
- Excellent adhesion
- Superior coating uniformity
Data sheet:
Ancillaries:
- Remover PG
- Remover 1112A
- MF-26A Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
Application:
- Dry etch
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
- E-beam Lithography
-
PMMA and Co-polymer Positive Resists
PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.
- E-beam and X-ray imageable
- Wide range of film thicknesses
- Excellent adhesion to most substrates
Data sheet:
Ancillaries:
- MCC Developers
- MIBK:IPA
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
-
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
Data sheet:
Ancillaries:
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
Applications:
- E-beam Lithography
- Negative DUV/e-beam
- Electrodeposition
-
InterVia™ 3D-P Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.
- Coating thickness capability from 2-10 µm
- Provides uniform, defect free coating
- Exposure at i-Line (365-405) wavelength
Data sheet:
Ancillaries:
- DuPont Developers
- DuPont Removers
Application:
-
InterVia™ 3D-N Electrophoretic Resists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
Data sheet:
Ancillaries:
- DuPont Developers
- DuPont Removers
Application:
- Grayscale
-
ma-P 1200G Positive Resist Series for Grayscale Lithography
Thick positive photoresist designed for the requirements of grayscale lithography
- Film thickness from 1 µm up to 60 µm and higher
- High intensity laser exposure possible without out-gassing
- 50-60 µm depth range of patterns
Data sheet:
Ancillaries:
- MRT Developers
- Remover PG
- MF-26A Developer
- MRT Removers
Application:
- Grayscale
- High Resolution i-Line
-
SPR™ 955-CM High-resolution i-Line Resists
General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications
- Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
- Contact holes on oxide
- Fast photospeed
Data sheet:
Ancillaries:
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- MF-26A Developer
- Remover 1165
- EBR-10A Edge Bead Remover
Applications:
- Bi layer lift-off
- High resolution i-Line
-
SPR™3600M Advanced i-Line Resists
Dyed photoresist for extremely high throughput processing on reflective substrates.
- Broadband, g-Line and i-Line capable
- Thermal stability ≥125°C
- Compatible across a wide variety of developer families
Data sheet:
Ancillaries:
- Remover PG
- Remover 1112A
- MF® CD-26 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
Application:
- High resolution i-Line
- Negative DUV/e-beam
-
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
Data sheet:
Ancillaries:
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
Applications:
- E-beam Lithography
- Negative DUV/e-beam
- Negative DUV Resists
-
UVN® 30 Negative DUV Photoresist
An advanced resist for 130 nm design rules:
- Low iso-dense bias
- Maximum isolated film retention to <110 nm
- Compatible with PSM & OPC assist features to enlarge process windows
Data sheet:
Ancillaries:
- CD-26 Developer
- MF-26 Developer
- Remover 1165
Application:
- 150 -180 nm nodes high etch resistance
-
ma-N 2400 DUV e-beam Resists
Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.
- Aqueous alkaline development
- High resolution capability (~ 40 – 50 nm)
- High wet and dry etch resistance
- Easy to remove
Data sheet:
Ancillaries:
- Remover PG
- MRT Developers
- MRT Removers
- ma-D 525
Applications:
- E-beam Lithography
- Negative DUV/e-beam
- Plating: Thick Negative Resists
-
TempKoat™ N 15 Negative Temporary Photoresist
Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.
- 7 to 20 µm film thickness in a single coat
- i-Line/broadband sensitivity, 2:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent resistance to copper plating chemistries
- Residue-free removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- INTERVIA™ 2011 Remover
- Remover PG
Applications
- Electroplating
- RDL
- Microbumping
-
KMPR® Permanent Negative Epoxy Resists
High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.
- > 100 µm film thickness in a single coat
- High aspect ratio with vertical sidewalls
- Chemical and plasma resistance
Data sheet:
Ancillaries:
- SU-8 Developer
- Remover PG
- MCC Thinner
- EBR-PG
Applications:
- DRIE
- Micro Molds & Stamps
- Plating: Thick negative Resists
- Electrowetting
- Dielectric Layers
- HAR Micro-plated Structures
-
BPR™-100 Thick Resists
Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)
- Single-spin film thickness >100 microns
- Near vertical side walls
- Excellent adhesion to all WLP substrates; excellent chemical resistance.
Data sheet:
Ancillaries:
- DuPont Developers
- DuPont Removers
Application:
- Plating: Thick negative resists
- Plating: Thick Positive Resists
-
TempKoat™ P 20 Thick Positive Resist
Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.
- 10 to 40 µm film thickness in a single coat
- i-Line/broadband sensitivity, 3:1 achievable aspect ratio
- Aqueous alkaline development (standard 0.26N TMAH)
- Excellent chemical resistance and residue-free removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-26A Developer
- MF-319 Developer
- MicroChem 303 A Developer
- Remover PG
Applications
- Electroplating
- RDL
- Microbumping
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
-
ma-P 1275 & ma-P 1275HV Thick Positive Resists
Thick photoresists designed for electroplating structures in microsystems technology
- Up to 60 µm film thickness
- High stability in acid and alkaline plating baths
- High dry and wet etch resistance
- Side wall angle up to 87° with mask aligner broadband exposure
Data sheet:
Ancillaries:
- MF-26A Developer
- MRT Developers
- Remover 1165
- EBR-10A Edge Bead Remover
- MRT Removers
Applications:
- Plating: Thick positive resists
- Microlenses
- Positive DUV Resists
-
UV6™ Positive DUV Resist
Optimized to provide vertical profile imaging of dense and semi-isolated features for device production design rules to 180 nm
- Superior etch resistance
- Wide process window
- 150° thermal stability
Data sheet:
Ancillaries:
- MF® CD-26 Developer
- EBR-10A Edge Bead Remover
- Remover 1165
Application:
- Positive DUV Resists
-
UV™26 Positive DUV Resist
Positive DUV photoresist developed for deep implant applications
- Low viscosity allows for reduced dispense volume
- Improved coating uniformity for films ranging from 1.1 µm to 3.0 µm
- 150°C thermal stability
Data sheet:
Ancillaries:
- MF® CD-26 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
Application:
- Positive DUV Resists
-
UV™135 Positive DUV Resist
An advanced resist for 130 nm design rules:
- Low iso-dense bias
- Maximum isolated film retention to <110 nm
- Compatible with PSM & OPC assist features to enlarge process windows
Data sheet:
Ancillaries:
- AR 3 BARC
- CD-26 Developer
- MF-26 Developer
- Remover 1165
Application:
- 130 nm device node
-
UV™210GS Positive DUV Resist
Multipurpose resist that can be utilized for gate, phase shift mask contact holes, and trench applications in the 180-130 nm CD range
- Compatible with a wide range of substrates including silicon and both organic and inorganic antireflective materials
- 150°C thermal stability
Data sheet:
Ancillaries:
- MF® CD-26 Developer
- EBR-10A Edge Bead Remover
- Remover 1165
Application:
- Positive DUV Resists
- Single Layer Lift-Off
-
UniLOR® N Single-layer Lift-off Photoresists
Negative-tone resists for lift-off processes.
- 1 to 5 µm film thickness range
- i-Line/Broadband sensitivity, 1:1 aspect ratio capability
- Adjustable sidewall profile angle
- Aqueous alkaline development (standard 0.26N TMAH developers)
- Pattern thermal stability up to 200°C
- Clean removal
Data Sheet
Ancillaries
- EBR PG
- CD-26 Developer
- MF-319 Developer
- Remover PG
- INTERVIA™ 2011 Remover
Applications
- Single-layer Lift-off
- Bi-layer Lift-off
- Deposition patterning of insulator layers
-
ma-N 400 & ma-N 1400 Negative Resists
Conventional pattern transfer and single-layer lift-off for microelectronics and micro systems technology
- High wet and dry etch resistance
- Good thermal stability of the resist pattern
- Tunable pattern profile: vertical to undercut
Data sheet:
Ancillaries:
- MRT Developers
- Remover PG
- MRT Removers
Application:
- Single layer lift-off
- Wet Etch
-
SPR™220 Thick i-Line Resists
General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process
- Film Thickness 1-30 µm
- Broadband, g-Line and i-Line capable
- Excellent wet and dry etch adhesion
Data sheet:
Ancillaries:
Applications:
- HAR Micro-plated Structures
- Bi layer lift-off
- Dry etch
- Plating: Thick positive resists
- Wet etch
- Microlenses
- DRIE
-
S1800® G2 Broadband Resists
Positive photoresists for advanced IC device fabrication.
- Cellosolve™ acetate and xylene-free
- Excellent adhesion and coating uniformity
- Optimized for g-Line exposure
Data sheet:
Ancillaries:
- MCC Developers
- Remover PG
- Remover 1112A
- MF-319 Developer
- M-351 Developer
- Remover 1165
- EBR-10A Edge Bead Remover
- MicroChem 303A Developer
- MicroChem 452 Developer
- MicroChem 455 Developer
Applications:
- Bi layer lift-off
- Wet etch
-
ma-P 1200 Positive Resist Series
Photoresist series designed for the use in microelectronics and microsystems technology
- Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
- Broadband, g-, h- and i-Line exposure
- Very good pattern stability in wet etch processes & acid & alkaline plating baths
- Highly stable in dry etch processes, e.g. CHF3, CF4, SF6
Data sheet:
Ancillaries:
- MRT Developers
- MF-26A Developer
- Remover PG
- Remover 1112A
- MRT Removers
Applications:
- Dry etch
- Mould for electroplating
- Wet etch
- Fabrication of micro lenses through pattern transfer of reflowed resist
Bi-Layer Lift-off Learn More
Dry Etch Learn More
E-beam Lithography Learn More
Electrodeposition Learn More
Grayscale
High Resolution i-Line Learn More
Negative DUV/e-beam
Negative DUV Resists Learn More
Plating: Thick Negative Resists Learn More
Plating: Thick Positive Resists Learn More
Positive DUV Resists Learn More
Single Layer Lift-Off
Wet Etch
-
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Micro & nano components
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
mr-NIL 6000E UV-cure Resist for Thermal NIL
UV-curable material for permanent applications with isothermal processing
- Excellent film quality on various substrate materials
- Very low residual layer thickness < 10 nm
- Excellent pattern transfer fidelity
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
-
mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps
Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
Very low release forces
No adhesion promoter or primer necessary
No oxygen inhibition
Mask for pattern transfer processes (dry and wet etching)Data Sheet
Applications:
- UV-based
- NIL Pattern transfer
-
mr-NIL210 Photo-curable Nanoimprint Resist
NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
- Increased dry etching resistance in demanding plasma processes
- Excellent reproducibility enabling high volume production
- Film thickness adjustable from sub 100 nm range up to several microns
Data sheet:
Applications:
- UV-based NIL
- Pattern Transfer
-
mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure sources
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
Data Sheet
Applications
- Soft UV-based NIL
- Etch mask for pattern transfer processes (dry and wet etching)
- Fabrication of nanostructures
-
mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist
NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.
- Very low release forces
- Excellent wetting properties
- Fast curing, high resolution
Data sheet:
Ancillaries
- mr-APS1 Adhesion Promoter
- ma-T 1050 Thinner
Applications:
- UV-based NIL
- Pattern Transfer
- Micro/nano high aspect ratio patterning
-
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
-
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
Data sheet:
Applications:
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
-
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
Data sheet:
Applications:
- UV-based NIL
- Pattern Transfer
- Permanent Applications
- Mold Replication
-
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
Data sheet:
Applications:
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
- Pattern Transfer
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
mr-NIL 6000E UV-cure Resist for Thermal NIL
UV-curable material for permanent applications with isothermal processing
- Excellent film quality on various substrate materials
- Very low residual layer thickness < 10 nm
- Excellent pattern transfer fidelity
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
-
mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps
Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
Very low release forces
No adhesion promoter or primer necessary
No oxygen inhibition
Mask for pattern transfer processes (dry and wet etching)Data Sheet
Applications:
- UV-based
- NIL Pattern transfer
-
mr-NIL210 Photo-curable Nanoimprint Resist
NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.
- Increased dry etching resistance in demanding plasma processes
- Excellent reproducibility enabling high volume production
- Film thickness adjustable from sub 100 nm range up to several microns
Data sheet:
Applications:
- UV-based NIL
- Pattern Transfer
-
mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure sources
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
Data Sheet
Applications
- Soft UV-based NIL
- Etch mask for pattern transfer processes (dry and wet etching)
- Fabrication of nanostructures
-
mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist
NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.
- Very low release forces
- Excellent wetting properties
- Fast curing, high resolution
Data sheet:
Ancillaries
- mr-APS1 Adhesion Promoter
- ma-T 1050 Thinner
Applications:
- UV-based NIL
- Pattern Transfer
- Micro/nano high aspect ratio patterning
-
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
Data sheet:
Applications:
- UV-based NIL
- Pattern Transfer
- Permanent Applications
- Permanent Applications
-
OrmoClear® Highly Transparent Materials for Micro-optics
Designed for the production of micro-optical components and wafer scale patterning
- For UV imprint and UV moulding
- Highly transparent for near UV and VIS down to 350 nm
- High thermal and mechanical stability
- Thickness up to 270 μm by spin coating (OrmoClear®30)
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Micro & nano components
-
OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components
Designed for the production of micro-optical components produced by UV moulding of optical components
- UV patterning (lithography, moulding and imprint)
- Highly transparent for VIS and near UV down to 350 nm
- High thermal, chemical and mechanical stability of cured patterns
- High resolution down to 100 nm feature size
Data sheet:
Ancillaries:
- OrmoDev
- OrmoPrime®08
- OrmoThin
Applications:
- Microlenses
- Microfluidics
- UV-based NIL
- Permanent Applications
- Micro and nano-optical components
-
OrmoStamp® UV-curable Hybrid Polymer with High Transparency
Ormostamp® for working stamp fabrication
- Highly transparent for UV and visible light
- Mechanically and thermally stable
- Excellent pattern transfer down to sub-100 nm features
Data sheet:
Applications:
- Transparent working stamp fabrication
- Cost efficient alternative to quartz stamp
- UV-based and thermal imprinting, nanoimprint lithography
-
mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes
NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.
- Solvent-free, low viscosity
- Excellent imprint characteristics
- Compatibility to various mold materials (Ni, Si, OrmoStamp®)
- Good adhesion to PC and PET substrates
- Excellent dry-etch resistance for pattern transfer
Data sheet:
Applications:
- UV-based NIL
- Pattern Transfer
- Permanent Applications
-
mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL
Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns
- Excellent properties for thermal NIL
- Longer life-time of anti-sticking layers on the mold
- High plasma etch resistance
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
-
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
- Permanent Applications
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer
Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns
- Excellent flowability
- Superior demolding characteristics
- Imprints can be performed at moderate temperatures in the range of 110 – 140°C.
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
- Pattern Transfer
-
mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL
Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns
- Excellent properties for thermal NIL
- Longer life-time of anti-sticking layers on the mold
- High plasma etch resistance
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
-
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
- Permanent Applications
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
-
SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer
Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns
- Excellent flowability
- Superior demolding characteristics
- Imprints can be performed at moderate temperatures in the range of 110 – 140°C.
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
- Permanent Applications
-
mr-I 9000M Thermal Cure Polymers for Thermal NIL
mr-I 9000M for micro and nanofabrication
- Compatible with various substrates including Si, Si02 and Al
- Short imprint cycle
- Thermal curing during imprint
Data sheet:
Applications:
- Thermal NIL
- Pattern Transfer
- Permanent Applications
-
mr-I T85 Thermoplastic polymer for Thermal NIL
Non-polar thermoplastic for permanent applications.
- High chemical resistance
- Excellent UV-vis transparency
- Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
- Appropriate for bio- and lab-on-chip applications
Data sheet:
Applications:
- Thermal NIL
- Lab-on-chip systems
UV-based NIL:
UV-based NIL:
Mold Replication
Pattern Transfer
Permanent Applications
Thermal NIL:
Thermal NIL:
Pattern Transfer
Permanent Applications
- Circuit & Electromechanical Assemblies
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-515-1 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
- Component or wire attachment
- Filling via holes or spaces
Features:
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
Data Sheets
-
EP-799 Black Potting Compound
Volume Resistivity: < 1.0 x 1014 Ω-cm
Applications:
- Potting components or assemblies
- Protection against moisture
- Protection against thermal or mechanical shock
Features:
- Excellent moisture resistance
- Excellent toughness and flexibility
- Fast curing
- Excellent mechanical properties and heat resistance
Data Sheets
-
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
-
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
Features:
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Data Sheets
- EL Panel and LED Lighting
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-510 Silver Conductive Ink
Applications:
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
Features:
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
Data Sheets
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
BT-101 Barium Titanate Dielectric
Volume Resistivity: > 1 x 1014 Ω-cm
Applications:
- Capacitance layer between phosphor and back electrodes for EL lamps on polyester or ITO substrates
Features:
- Rigid thermal dielectric
- Electrically insulating
- Very moisture resistant
- Produces mirror smooth surface finish
Data Sheets
-
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
-
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
Features:
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Data Sheets
-
PH-745 Phosphor Binder
Surface Resistivity: 5.0 x 1015 Ω/square
Applications:
- For use as a capacitance layer in EL Applications
Features:
- Blend with phosphor powder for customer blended ink
- Excellent flexibility electrical insulation
- Maintains high dielectric constant for optimal EL lamp performance
- Outstanding adhesion to ITO surfaces
Data Sheets
- Inkjet Printing
-
InkOrmo Jettable Hybrid Polymer
UV-curable hybrid polymer for ink-jet printing of optical micro patterns
- Low viscosity (solvent-ratio dependent)
- Compatible to standard ink-jet printing devices
- Excellent thermal, mechanical, and chemical stability of cured patterns
Data sheet:
Application:
- Inkjet printing
- Medical Devices
-
AG-515-1 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
-
AGCL-675 Silver/Silver Chloride Ink
Applications:
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
Features:
- Silver to silver chloride ratios can be adjusted
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
Data Sheets
-
AGCL-1134 Silver/Silver Chloride Ink
Applications:
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
Features:
- 50/50 blend
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
Data Sheets
-
AGCL-1194 Silver/Silver Chloride Ink
Applications:
- Disposable EKG and EEG electrodes
- Defibrillator pads
- Medical sensors
Features:
- 65/35 blend
- Screen print, dip or thin for gravure print
- Smooth surface finish
- Can be blended for different resistance values
- Excellent adhesion & crease resistance to polyester & plastic substrates
Data Sheets
-
RO-593 Radio Opaque Ink
Surface Resistivity: 2.9 x 1013 Ω/square
Applications:
- Printed visual references for X-ray, MRI, CT or other imaging equipment
Features:
- Smooth finish
- Can be colored
- Fast drying
- Screen, gravure, flexographic
- Can apply by brush or syringe
- Compatible with Parylene overcoats
Data Sheets
-
RO-948 Radio Opaque Ink
Applications:
- Visual reference tags for use with devices exposed to X-ray and other imaging technologies
Features:
- Smooth finish printing
- Gray color
- Can be applied by screen, high speed roll printing processes, coating, dipping, and manual processing (for prototypes)
Data Sheets
- Membrane Switches
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-515-1 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
-
AG-510 Silver Conductive Ink
Applications:
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
Features:
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
Data Sheets
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
C-250J Carbon Screenprint Ink
Surface Resistivity: < 5.0 Ω/square/mil
Applications:
- Membrane switches
- Overprint for silver conductive traces
- Flex circuits
- Additive circuits
- In-mold electronics
Features:
- Highly conductive
- Screen print, spray, dip or coat
- Excellent adhesion to metal, polyester & polyimide substrates
- Can be blended with AG-800 for specific resistance values
- Can be used as base electrode for EL panels
Data sheets:
-
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
-
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
- Component or wire attachment
- Filling via holes or spaces
Features:
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
Data Sheets
-
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
-
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
Features:
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Data Sheets
- Printed Heaters & Thermal Targets
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-515-1 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
-
AG-510 Silver Conductive Ink
Applications:
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
Features:
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
Data Sheets
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
C-250J Carbon Screenprint Ink
Surface Resistivity: < 5.0 Ω/square/mil
Applications:
- Membrane switches
- Overprint for silver conductive traces
- Flex circuits
- Additive circuits
- In-mold electronics
Features:
- Highly conductive
- Screen print, spray, dip or coat
- Excellent adhesion to metal, polyester & polyimide substrates
- Can be blended with AG-800 for specific resistance values
- Can be used as base electrode for EL panels
Data sheets:
-
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
Features:
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Data Sheets
- RFID and Cell Phone Antennas
-
AG-515-1 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Silver–filled, electrically conductive ink or coating designed for spraying, dipping & slot die coating
- Can be thinned with solvent for spraying, dipping or slot die coating for EMI/RFI shielding applications
- Long open time to reduce nozzle clogging
- Extremely tough, scuff resistant, crease resistant
- Excellent adhesion to polyester, polyimide and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
WB-1078 Water Based Silver Conductive Ink
Applications:
- RFID tags
- Cell phone antennas
- Medical EEG/EKG sensors
- EMI/RFI shielding
Features:
- Gravure or high speed processes
- Suitable for spray, dipping or coating
- Low viscosity, high solids silver ink
- Electrically conductive
- Can be cross linked
Data Sheets
- Solar Panels
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-510 Silver Conductive Ink
Applications:
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
Features:
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
Data Sheets
-
AG-800 Silver Conductive Ink
Applications:
- Flex circuits
- Membrane switches
- Additive circuits
- EMI/RFI applications
- Thermal targets
Features:
- Good conductivity
- Screen print
- Thin for spray or dipping
- Can blend with carbon to customize resistance
- Crease resistant
Data Sheets
-
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
- Component or wire attachment
- Filling via holes or spaces
Features:
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
Data Sheets
-
UV-2530 UV Curable Matte Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Matte finish
- Screen printable, dip, roll, knife over roll, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-2531 UV Curable Glossy Dielectric
Surface Resistivity: @25°C 5.0 x 1015 Ω/square/mil
Applications:
- PTF circuits
- Flexible circuit substrates
- Printed insulation layers for circuits
- Dielectric layer for membrane switch crossover and tail coat applications on flexible circuits & membrane switches
Features:
- Glossy finish
- Screen print, dip, roll, knife over roll coating, curtain coating or die application
- 100% solids
- Available in clear, blue or green colors
- Low odor
Data Sheets
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
- Surface Mount Component Attachment
-
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
- Component or wire attachment
- Filling via holes or spaces
Features:
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
Data Sheets
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
- Touch Screens
-
AG-500A Silver Conductive Ink
Applications:
- Circuit and Electromechanical Assemblies
- EL Panel and LED Lighting
- Membrane switch
- Touch screens
- Printed Heaters
- Other printed electronic applications
Features:
- Screen printable
- Extremely tough, scuff resistant and crease resistant
- Ideal for long traces
- Excellent adhesion to polyester, polyimide, ITO and most other substrates
- Compatible with our UV curable dielectrics, all of our conductive epoxy adhesives and our UV curable component encapsulants and conformal coatings
Data Sheets
-
AG-510 Silver Conductive Ink
Applications:
- Additive circuits
- Printed heaters
- PTF circuits
- Defibrillator pads
- EKG/EEG electrodes
- Blood glucose sensors
- EMI/RFI applications
- EL panels
- Membrane switches
Features:
- Screen print
- Fast Drying
- High conductivity
- Thin for spray or dipping
- Can blend with carbon to customize resistance
Data Sheets
-
Transparent Conductive Inks
Kayaku Advanced Materials, Inc. is the AGFA-approved reseller of OrgaCon™ Transparent Conductive Inks in the U.S.A. & Canada. OrgaCon screen-printable inks are based on conductive polymer PEDOT/PSS patterning of transparent conductive structures from plain down to a resolution of 100 microns on flexible and rigid substrates such as PET, PC, PMMA, PI and glass. These inks can achieve excellent characteristics such as flexibility and formability for electrodes of electroluminescent lamps, capacitive touch sensors and membrane switches. OrgaCon transparent conductive inks eliminate the need for ITO and provide flexibility not found using ITO.Kayaku Advanced Materials, Inc. – Products for Functional Printed Electronics
Kayaku Advanced Materials, Inc.is your source for conductive & resistive inks, dielectrics, epoxies and more.
-
EP-600 Two-Part Silver Filled Conductive Epoxy
Volume Resistivity: < 1.0 x 10-3 Ω-cm
Applications:
- Component or wire attachment
- Filling via holes or spaces
Features:
- Two-part electrically conductive epoxy
- Dot dispense, screen print or manual dispense
- Low cure temperature
- Fast curing
- Suitable for flexible substrates
- 6 month shelf life
- Available in pre-measured CC-paks or bulk
Data Sheets
-
UV-3010 UV Curable Coating/Encapsulant
Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil
Applications:
- Component encapsulation
- Printed circuit board protection
Features:
- 100% solids
- Dot dispensable
- Moisture resistant
- Suitable for flexible substrates
- Can be sprayed or dipped
Data Sheets
-
Z-904 Ultraviolet Curable Anisotropic Ink
Applications:
- For screen printing over conductive ink tail pins on flexible circuits and membrane switches, to provide protection for silver ink when using ZIF or crimp type metal connectors, while still maintaining electrical conductivity between the metal connector and the silver ink pin.
Features:
- Designed to conduct electricity on the Z-axis through the thickness, and not along the width (X-Axis) or length (Y-Axis) of the printed ink.
- Excellent strength, toughness, flexibility, inherent moisture resistance, and low odor.
Data Sheets
Circuit & Electromechanical Assemblies Learn More
EL Panel and LED Lighting Learn More
Inkjet Printing
Medical Devices Learn More
Membrane Switches Learn More
Printed Heaters & Thermal Targets Learn More
RFID and Cell Phone Antennas Learn More
Solar Panels Learn More
Surface Mount Component Attachment Learn More
Touch Screens Learn More
Kayaku Advanced Materials, Inc. Products
Permanent Photo-patternable Epoxies
Permanent Photo-patternable Low k Dielectrics
Temporary Lift-off Resists
Temporary Plating Resists
Other Manufacturers Whose Products We Distribute & Support
