Products by Applications

Home 5 Products by Applications

  • Advanced Packaging

    • Dielectric Layer

      • Dielectric Layer Learn More

      KMSF® 1000 Low Stress Photo-dielectric

      KMSF® 1000 Low Stress Photo-dielectric

      Negative-tone, ultra-low stress photo-patternable dielectric for wafer level packaging.

      • ~ 3-10 µm film thickness
      • No warpage due to low shrinkage and low tensile modulus
      • Solvent-developable in Cyclopentanone
      • i-Line/broadband sensitivity, 1:1 aspect ratio imaging
      • Low temperature cure < 200°C
      • Good electrical properties
      • Low moisture uptake
      • High thermal and chemical stability

      Data Sheet 

      Ancillaries 

      Applications 

      • Stress buffer
      • Passivation and protective layer

      KMSF® 2000 Low Dk/Df Photo-dielectric

      KMSF® 2000 Low Dk/Df Photo-dielectric

      Negative-tone, low temperature cure, low Dk/Df photo-patternable dielectric for wafer level Packaging.

      • Negative tone, photoimageable dielectric
      • 5 to 10 µm film thickness after cure
      • Solvent-developable in PGMEA
      • i-Line/broadband sensitivity, 1:1 aspect ratio imaging
      • Low temperature cure ≤ 200°C
      • Low Dk/Df electrical properties
      • Low moisture uptake
      • Good thermal and chemical stability

      Data Sheet 

      Ancillaries 

      Applications 

    • Electrodeposition

      • Electrodeposition Learn More

      InterVia™ 3D-P Electrophoretic Resists

      InterVia™ 3D-P Electrophoretic Resists

      Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.

      • Coating thickness capability from 2-10 µm
      • Provides uniform, defect free coating
      • Exposure at i-Line (365-405) wavelength

      Data sheet:

      Ancillaries:

      • DuPont Developers
      • DuPont Removers

      Application:

      InterVia™ 3D-N Electrophoretic Resists

      InterVia™ 3D-N Electrophoretic Resists

      Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.

      • Coating thickness capability up to 12.5 microns
      • Provides uniform, defect free coating
      • Resolution capability of 1:1

      Data sheet:

      Ancillaries:

      • DuPont Developers
      • DuPont Removers

      Application:

    • Plating

      • Plating Learn More

      TempKoat™ P 20 Thick Positive Resist

      TempKoat™ P 20 Thick Positive Resist

      Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.

      • 10 to 40 µm film thickness in a single coat
      • i-Line/broadband sensitivity, 3:1 achievable aspect ratio
      • Aqueous alkaline development (standard 0.26N TMAH)
      • Excellent chemical resistance and residue-free removal

      Data Sheet 

      Ancillaries 

      Applications 

      • Electroplating
      • RDL
      • Microbumping

      TempKoat™ N 15 Thick Negative Resist

      TempKoat™ N 15 Negative Temporary Photoresist

      Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.

      • 7 to 20 µm film thickness in a single coat
      • i-Line/broadband sensitivity, 2:1 achievable aspect ratio
      • Aqueous alkaline development (standard 0.26N TMAH)
      • Excellent resistance to copper plating chemistries
      • Residue-free removal

      Data Sheet

      Ancillaries

      Applications

      • Electroplating
      • RDL
      • Microbumping

      KMPR® Permanent Negative Epoxy Resists

      KMPR® Permanent Negative Epoxy Resists

      High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.

      • > 100 µm film thickness in a single coat
      • High aspect ratio with vertical sidewalls
      • Chemical and plasma resistance

      Data sheet:

      Ancillaries:

      Applications:

      SPR™220 Thick i-Line Resists

      SPR™220 Thick i-Line Resists

      General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process

      • Film Thickness 1-30 µm
      • Broadband, g-Line and i-Line capable
      • Excellent wet and dry etch adhesion

      Data sheet:

      Ancillaries:

      Applications:

      ma-P 1200 Positive Resist Series

      ma-P 1200 Positive Resist Series

      Photoresist series designed for the use in microelectronics and microsystems technology

      • Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
      • Broadband, g-, h- and i-Line exposure
      • Very good pattern stability in wet etch processes & acid & alkaline plating baths
      • Highly stable in dry etch processes, e.g. CHF3, CF4, SF6

      Data sheet:

      Ancillaries:

      Applications:

      • Dry etch
      • Mould for electroplating
      • Wet etch
      • Fabrication of micro lenses through pattern transfer of reflowed resist

      ma-P 1275 & ma-P 1275HV Thick Positive Resists

      ma-P 1275 & ma-P 1275HV Thick Positive Resists

      Thick photoresists designed for electroplating structures in microsystems technology

      • Up to 60 µm film thickness
      • High stability in acid and alkaline plating baths
      • High dry and wet etch resistance
      • Side wall angle up to 87° with mask aligner broadband exposure

      Data sheet:

      Ancillaries:

      Applications:

  • III-Vs, Optoelectronics

  • Circuit & Electromechanical Assemblies

  • MEMS

  • EL Panel and LED Lighting

  • Inkjet Printing

  • Optical Components

    • Micro & Nano Components

      • Micro & Nano Components

      SU-8 Permanent Negative Epoxy Resists

      SU-8 Permanent Negative Epoxy Resists

      High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.

      • Film thickness: 1-200 µm
      • High aspect ratio imaging with near vertical side walls
      • Near UV (350-400nm) processing

      Data sheets:

      Ancillaries:

      Applications:

      SU-8 TF 6000 Negative Resist

      SU-8 TF 6000 Negative Resist

      SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.

      • Photo-imageable thin films with high resolution i-line patterning capability
      • Broadband, i-line, g-line and h-line sensitivity
      • Low temperature cure (< 150°C)
      • Highly uniform thin films

      Data Sheet:

      Applications:

      OrmoClear® Highly Transparent Materials for Micro-optics

      OrmoClear® Highly Transparent Materials for Micro-optics

      Designed for the production of micro-optical components and wafer scale patterning

      • For UV imprint and UV moulding
      • Highly transparent for near UV and VIS down to 350 nm
      • High thermal and mechanical stability
      • Thickness up to 270 μm by spin coating (OrmoClear®30)

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Applications:

      OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

      OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

      Designed for the production of micro-optical components produced by UV moulding of optical components

      • UV patterning (lithography, moulding and imprint)
      • Highly transparent for VIS and near UV down to 350 nm
      • High thermal, chemical and mechanical stability of cured patterns
      • High resolution down to 100 nm feature size

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Applications:

    • Waveguides

      • Waveguides

      SU-8 Permanent Negative Epoxy Resists

      SU-8 Permanent Negative Epoxy Resists

      High contrast, epoxy photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired.

      • Film thickness: 1-200 µm
      • High aspect ratio imaging with near vertical side walls
      • Near UV (350-400nm) processing

      Data sheets:

      Ancillaries:

      Applications:

      SU-8 TF 6000 Negative Resist

      SU-8 TF 6000 Negative Resist

      SU-8 TF 6000 negative resists are sensitive to broadband UV radiations (i-, h- and g-line) and recommended wherever high resolution, photo-imageable thin permanent structures are required.

      • Photo-imageable thin films with high resolution i-line patterning capability
      • Broadband, i-line, g-line and h-line sensitivity
      • Low temperature cure (< 150°C)
      • Highly uniform thin films

      Data Sheet:

      Applications:

      EpoCore/Clad Polymers for Waveguide Fabrication

      EpoCore/Clad Polymers for Waveguide Fabrication

      Resist system for laminated waveguides

      • UV patterning of core and cladding
      • High transmittance @ 850 nm
      • High heat and pressure resistance

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Application:

      OrmoCore/Clad Photo Patterning Hybrid Polymers

      OrmoCore/Clad Photo Patterning Hybrid Polymers

      ORMOCER® System for Planar Optical Waveguides

      • UV patterning (lithography/moulding)
      • Exposure: i-line, broadband
      • Thermally stable up to 270°C
      • Low optical loss

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Application:

      Hybrid polymers based on ORMOCER®s for micro-optics licensed by the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.

  • Display

  • Medical Devices

  • General Lithography

    • Bi-Layer Lift-off

      • Bi-Layer Lift-off Learn More

      PMGI/LOR Lift-off Resists

      PMGI/LOR Lift-off Resists

      Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.

      • High thermal stability: Tg ∼190°C
      • Enables sub 0.25µm bi-layer resist imaging
      • Single step development of bi-layer stack in TMAH or KOH developers

      Data sheets:

      Ancillaries:

      Applications:

      UniLOR® N Negative Lift-off Resists

      UniLOR® N Single-layer Lift-off Photoresists

      Negative-tone resists for lift-off processes.

      • 1 to 5 µm film thickness range
      • i-Line/Broadband sensitivity, 1:1 aspect ratio capability
      • Adjustable sidewall profile angle
      • Aqueous alkaline development (standard 0.26N TMAH developers)
      • Pattern thermal stability up to 200°C
      • Clean removal

      Data Sheet 

      Ancillaries 

      Applications 

      LOL™ 1000 & 2000 Lift-off Layers

      LOL™ 1000 & 2000 Lift-off Layers

      Enhanced dissolution rate, dyed PMGI solution used for lift-off processes requiring tight CD control.

      • Sub-micron lift-off capability
      • Compatible with g-, h-, and i-Line and 193 nm photoresists
      • Excellent adhesion to thin film head and semiconductor substrates

      Data sheet:

      Ancillaries:

      Application:

      • Bi layer lift-off

      SPR™220 Thick i-Line Resists

      SPR™220 Thick i-Line Resists

      General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process

      • Film Thickness 1-30 µm
      • Broadband, g-Line and i-Line capable
      • Excellent wet and dry etch adhesion

      Data sheet:

      Ancillaries:

      Applications:

      S1800® G2 Broadband Resists

      S1800® G2 Broadband Resists

      Positive photoresists for advanced IC device fabrication.

      • Cellosolve™ acetate and xylene-free
      • Excellent adhesion and coating uniformity
      • Optimized for g-Line exposure

      Data sheet:

      Ancillaries:

      Applications:

      SPR™ 955-CM High-resolution i-Line Resists

      SPR™ 955-CM High-resolution i-Line Resists

      General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications

      • Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
      • Contact holes on oxide
      • Fast photospeed

      Data sheet:

      Ancillaries:

      Applications:

      • Bi layer lift-off
      • High resolution i-Line

    • Dry Etch

      • Dry Etch Learn More

      KMPR® Permanent Negative Epoxy Resists

      KMPR® Permanent Negative Epoxy Resists

      High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.

      • > 100 µm film thickness in a single coat
      • High aspect ratio with vertical sidewalls
      • Chemical and plasma resistance

      Data sheet:

      Ancillaries:

      Applications:

      SPR™220 Thick i-Line Resists

      SPR™220 Thick i-Line Resists

      General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process

      • Film Thickness 1-30 µm
      • Broadband, g-Line and i-Line capable
      • Excellent wet and dry etch adhesion

      Data sheet:

      Ancillaries:

      Applications:

      SPR™3000 Series Broadband Resists

      SPR™3000 Series Broadband Resists

      SPR™3000 Series Broadband Resists

      Positive photoresist engineered for i-line, g-line, and broadband applications with high resolution, high throughput, and excellent process latitudes.

      • Glycol ether- and xylene-free solvent system
      • Excellent adhesion
      • Superior coating uniformity

      Data sheet:

      Ancillaries:

      Application:

      • Dry etch

      ma-P 1200 Positive Resist Series

      ma-P 1200 Positive Resist Series

      Photoresist series designed for the use in microelectronics and microsystems technology

      • Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
      • Broadband, g-, h- and i-Line exposure
      • Very good pattern stability in wet etch processes & acid & alkaline plating baths
      • Highly stable in dry etch processes, e.g. CHF3, CF4, SF6

      Data sheet:

      Ancillaries:

      Applications:

      • Dry etch
      • Mould for electroplating
      • Wet etch
      • Fabrication of micro lenses through pattern transfer of reflowed resist

    • E-beam Lithography

      • E-beam Lithography Learn More

      PMMA and Co-polymer Positive Resists

      PMMA and Co-polymer Positive Resists

      PMMA and co-polymer e-beam resists for direct write applications. Excellent for T-gate and other metal deposition processes.

      • E-beam and X-ray imageable
      • Wide range of film thicknesses
      • Excellent adhesion to most substrates

      Data sheet:

      Ancillaries:

      Applications:

      ma-N 2400 DUV e-beam Resists

      ma-N 2400 DUV e-beam Resists

      Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.

      • Aqueous alkaline development
      • High resolution capability (~ 40 – 50 nm)
      • High wet and dry etch resistance
      • Easy to remove

      Data sheet:

      Ancillaries:

      Applications:

    • Electrodeposition

      • Electrodeposition Learn More

      InterVia™ 3D-P Electrophoretic Resists

      InterVia™ 3D-P Electrophoretic Resists

      Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposition.

      • Coating thickness capability from 2-10 µm
      • Provides uniform, defect free coating
      • Exposure at i-Line (365-405) wavelength

      Data sheet:

      Ancillaries:

      • DuPont Developers
      • DuPont Removers

      Application:

      InterVia™ 3D-N Electrophoretic Resists

      InterVia™ 3D-N Electrophoretic Resists

      Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition.

      • Coating thickness capability up to 12.5 microns
      • Provides uniform, defect free coating
      • Resolution capability of 1:1

      Data sheet:

      Ancillaries:

      • DuPont Developers
      • DuPont Removers

      Application:

    • Grayscale

      • Grayscale

      ma-P 1200G Positive Resist Series for Grayscale Lithography

      ma-P 1200G Positive Resist Series for Grayscale Lithography

      Thick positive photoresist designed for the requirements of grayscale lithography

      • Film thickness from 1 µm up to 60 µm and higher
      • High intensity laser exposure possible without out-gassing
      • 50-60 µm depth range of patterns

      Data sheet:

      Ancillaries:

      • MRT Developers
      • Remover PG
      • MF-26A Developer
      • MRT Removers

      Application:

      • Grayscale

    • High Resolution i-Line

      • High Resolution i-Line Learn More

      SPR™ 955-CM High-resolution i-Line Resists

      SPR™ 955-CM High-resolution i-Line Resists

      General purpose, high-throughput, i-Line photoresist for 0.35 µm front-end and back-end applications

      • Dense lines/spaces and isolated lines on polysilicon, and in high-aspect ratio films on TiN
      • Contact holes on oxide
      • Fast photospeed

      Data sheet:

      Ancillaries:

      Applications:

      • Bi layer lift-off
      • High resolution i-Line

      SPR™3600M Advanced i-Line Resists

      SPR™3600M Advanced i-Line Resists

      Dyed photoresist for extremely high throughput processing on reflective substrates.

      • Broadband, g-Line and i-Line capable
      • Thermal stability ≥125°C
      • Compatible across a wide variety of developer families

      Data sheet:

      Ancillaries:

      Application:

      • High resolution i-Line

    • Negative DUV/e-beam

      • Negative DUV/e-beam

      ma-N 2400 DUV e-beam Resists

      ma-N 2400 DUV e-beam Resists

      Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.

      • Aqueous alkaline development
      • High resolution capability (~ 40 – 50 nm)
      • High wet and dry etch resistance
      • Easy to remove

      Data sheet:

      Ancillaries:

      Applications:

    • Negative DUV Resists

      • Negative DUV Resists Learn More

      UVN® 30 Negative DUV Photoresist

      UVN® 30 Negative DUV Photoresist

      An advanced resist for 130 nm design rules:

      • Low iso-dense bias
      • Maximum isolated film retention to <110 nm
      • Compatible with PSM & OPC assist features to enlarge process windows

      Data sheet:

      Ancillaries:

      Application:

      • 150 -180 nm nodes high etch resistance

      ma-N 2400 DUV e-beam Resists

      ma-N 2400 DUV e-beam Resists

      Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices.

      • Aqueous alkaline development
      • High resolution capability (~ 40 – 50 nm)
      • High wet and dry etch resistance
      • Easy to remove

      Data sheet:

      Ancillaries:

      Applications:

    • Plating: Thick Negative Resists

      • Plating: Thick Negative Resists Learn More

      TempKoat™ N 15 Thick Negative Resist

      TempKoat™ N 15 Negative Temporary Photoresist

      Thick, negative-tone, temporary resist for advanced packaging and MEMS applications.

      • 7 to 20 µm film thickness in a single coat
      • i-Line/broadband sensitivity, 2:1 achievable aspect ratio
      • Aqueous alkaline development (standard 0.26N TMAH)
      • Excellent resistance to copper plating chemistries
      • Residue-free removal

      Data Sheet

      Ancillaries

      Applications

      • Electroplating
      • RDL
      • Microbumping

      KMPR® Permanent Negative Epoxy Resists

      KMPR® Permanent Negative Epoxy Resists

      High contrast, epoxy photoresist for DRIE and plating, TMAH-developable.

      • > 100 µm film thickness in a single coat
      • High aspect ratio with vertical sidewalls
      • Chemical and plasma resistance

      Data sheet:

      Ancillaries:

      Applications:

      BPR™-100 Thick Resists

      BPR™-100 Thick Resists

      Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)

      • Single-spin film thickness >100 microns
      • Near vertical side walls
      • Excellent adhesion to all WLP substrates; excellent chemical resistance.

      Data sheet:

      Ancillaries:

      • DuPont Developers
      • DuPont Removers

      Application:

      • Plating: Thick negative resists

    • Plating: Thick Positive Resists

      • Plating: Thick Positive Resists Learn More

      TempKoat™ P 20 Thick Positive Resist

      TempKoat™ P 20 Thick Positive Resist

      Thick, positive-tone, temporary resist for advanced packaging and MEMS applications.

      • 10 to 40 µm film thickness in a single coat
      • i-Line/broadband sensitivity, 3:1 achievable aspect ratio
      • Aqueous alkaline development (standard 0.26N TMAH)
      • Excellent chemical resistance and residue-free removal

      Data Sheet 

      Ancillaries 

      Applications 

      • Electroplating
      • RDL
      • Microbumping

      SPR™220 Thick i-Line Resists

      SPR™220 Thick i-Line Resists

      General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process

      • Film Thickness 1-30 µm
      • Broadband, g-Line and i-Line capable
      • Excellent wet and dry etch adhesion

      Data sheet:

      Ancillaries:

      Applications:

      ma-P 1200 Positive Resist Series

      ma-P 1200 Positive Resist Series

      Photoresist series designed for the use in microelectronics and microsystems technology

      • Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
      • Broadband, g-, h- and i-Line exposure
      • Very good pattern stability in wet etch processes & acid & alkaline plating baths
      • Highly stable in dry etch processes, e.g. CHF3, CF4, SF6

      Data sheet:

      Ancillaries:

      Applications:

      • Dry etch
      • Mould for electroplating
      • Wet etch
      • Fabrication of micro lenses through pattern transfer of reflowed resist

      ma-P 1275 & ma-P 1275HV Thick Positive Resists

      ma-P 1275 & ma-P 1275HV Thick Positive Resists

      Thick photoresists designed for electroplating structures in microsystems technology

      • Up to 60 µm film thickness
      • High stability in acid and alkaline plating baths
      • High dry and wet etch resistance
      • Side wall angle up to 87° with mask aligner broadband exposure

      Data sheet:

      Ancillaries:

      Applications:

    • Positive DUV Resists

      • Positive DUV Resists Learn More

      UV6™ Positive DUV Resist

      UV6™ Positive DUV Resist

      Optimized to provide vertical profile imaging of dense and semi-isolated features for device production design rules to 180 nm

      • Superior etch resistance
      • Wide process window
      • 150° thermal stability

      Data sheet:

      Ancillaries:

      Application:

      • Positive DUV Resists

      UV™26 Positive DUV Resist

      UV™26 Positive DUV Resist

      Positive DUV photoresist developed for deep implant applications

      • Low viscosity allows for reduced dispense volume
      • Improved coating uniformity for films ranging from 1.1 µm to 3.0 µm
      • 150°C thermal stability

      Data sheet:

      Ancillaries:

      Application:

      • Positive DUV Resists

      UV™135 Positive DUV Resist

      UV™135 Positive DUV Resist

      An advanced resist for 130 nm design rules:

      • Low iso-dense bias
      • Maximum isolated film retention to <110 nm
      • Compatible with PSM & OPC assist features to enlarge process windows

      Data sheet:

      Ancillaries:

      Application:

      • 130 nm device node

      UV™210GS Positive DUV Resist

      UV™210GS Positive DUV Resist

      Multipurpose resist that can be utilized for gate, phase shift mask contact holes, and trench applications in the 180-130 nm CD range

      • Compatible with a wide range of substrates including silicon and both organic and inorganic antireflective materials
      • 150°C thermal stability

      Data sheet:

      Ancillaries:

      Application:

      • Positive DUV Resists

    • Single Layer Lift-Off

      • Single Layer Lift-Off

      UniLOR® N Negative Lift-off Resists

      UniLOR® N Single-layer Lift-off Photoresists

      Negative-tone resists for lift-off processes.

      • 1 to 5 µm film thickness range
      • i-Line/Broadband sensitivity, 1:1 aspect ratio capability
      • Adjustable sidewall profile angle
      • Aqueous alkaline development (standard 0.26N TMAH developers)
      • Pattern thermal stability up to 200°C
      • Clean removal

      Data Sheet 

      Ancillaries 

      Applications 

      ma-N 400 & ma-N 1400 Negative Resists

      ma-N 400 & ma-N 1400 Negative Resists

      Conventional pattern transfer and single-layer lift-off for microelectronics and micro systems technology

      • High wet and dry etch resistance
      • Good thermal stability of the resist pattern
      • Tunable pattern profile: vertical to undercut

      Data sheet:

      Ancillaries:

      Application:

      • Single layer lift-off

    • Wet Etch

      • Wet Etch

      SPR™220 Thick i-Line Resists

      SPR™220 Thick i-Line Resists

      General purpose, multi-wavelength photoresist designed to cover a wide range of film thicknesses with a single-coat process

      • Film Thickness 1-30 µm
      • Broadband, g-Line and i-Line capable
      • Excellent wet and dry etch adhesion

      Data sheet:

      Ancillaries:

      Applications:

      S1800® G2 Broadband Resists

      S1800® G2 Broadband Resists

      Positive photoresists for advanced IC device fabrication.

      • Cellosolve™ acetate and xylene-free
      • Excellent adhesion and coating uniformity
      • Optimized for g-Line exposure

      Data sheet:

      Ancillaries:

      Applications:

      ma-P 1200 Positive Resist Series

      ma-P 1200 Positive Resist Series

      Photoresist series designed for the use in microelectronics and microsystems technology

      • Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step
      • Broadband, g-, h- and i-Line exposure
      • Very good pattern stability in wet etch processes & acid & alkaline plating baths
      • Highly stable in dry etch processes, e.g. CHF3, CF4, SF6

      Data sheet:

      Ancillaries:

      Applications:

      • Dry etch
      • Mould for electroplating
      • Wet etch
      • Fabrication of micro lenses through pattern transfer of reflowed resist

  • Membrane Switches

  • Nanoimprint Lithography

      • UV-based NIL:

      UV-based NIL:

      OrmoClear® Highly Transparent Materials for Micro-optics

      OrmoClear® Highly Transparent Materials for Micro-optics

      Designed for the production of micro-optical components and wafer scale patterning

      • For UV imprint and UV moulding
      • Highly transparent for near UV and VIS down to 350 nm
      • High thermal and mechanical stability
      • Thickness up to 270 μm by spin coating (OrmoClear®30)

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Applications:

      mr-I T85 Thermoplastic polymer for Thermal NIL

      mr-I T85 Thermoplastic polymer for Thermal NIL

      Non-polar thermoplastic for permanent applications.

      • High chemical resistance
      • Excellent UV-vis transparency
      • Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
      • Appropriate for bio- and lab-on-chip applications

      Data sheet:

      Applications:

      • Thermal NIL
      • Lab-on-chip systems

      mr-NIL 6000E UV-cure Resist for Thermal NIL

      mr-NIL 6000E UV-cure Resist for Thermal NIL

      UV-curable material for permanent applications with isothermal processing

      • Excellent film quality on various substrate materials
      • Very low residual layer thickness < 10 nm
      • Excellent pattern transfer fidelity

      Data sheet:

      Applications:

      • Thermal NIL
      • Pattern Transfer

      mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps

      mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps

      Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
      Very low release forces
      No adhesion promoter or primer necessary
      No oxygen inhibition
      Mask for pattern transfer processes (dry and wet etching)

      Data Sheet

      Applications:

      • UV-based
      • NIL Pattern transfer

      mr-NIL210 Photo-curable Nanoimprint Resist

      mr-NIL210 Photo-curable Nanoimprint Resist

      NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.

      • Increased dry etching resistance in demanding plasma processes
      • Excellent reproducibility enabling high volume production
      • Film thickness adjustable from sub 100 nm range up to several microns

      Data sheet:

      Applications:

      • UV-based NIL
      • Pattern Transfer

      mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance

      mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance

      mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.

      • Excellent stability in plasma etching processes
      • Fast curing even with low intensity light exposure sources
      • Excellent liquid thin film stability and thin film quality
      • Outstanding compatibility with flexible stamp materials
      • Residue-free removal with oxygen plasma post-cure

      Data Sheet

      Applications

      • Soft UV-based NIL
      • Etch mask for pattern transfer processes (dry and wet etching)
      • Fabrication of nanostructures

      mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist

      mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist

      NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.

      • Very low release forces
      • Excellent wetting properties
      • Fast curing, high resolution

      Data sheet:

      Ancillaries

      • mr-APS1 Adhesion Promoter
      • ma-T 1050 Thinner

      Applications:

      • UV-based NIL
      • Pattern Transfer
      • Micro/nano high aspect ratio patterning

      OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

      OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

      Designed for the production of micro-optical components produced by UV moulding of optical components

      • UV patterning (lithography, moulding and imprint)
      • Highly transparent for VIS and near UV down to 350 nm
      • High thermal, chemical and mechanical stability of cured patterns
      • High resolution down to 100 nm feature size

      Data sheet:

      Ancillaries:

      • OrmoDev
      • OrmoPrime®08
      • OrmoThin

      Applications:

      OrmoStamp® UV-curable Hybrid Polymer with High Transparency

      OrmoStamp® UV-curable Hybrid Polymer with High Transparency

      Ormostamp® for working stamp fabrication

      • Highly transparent for UV and visible light
      • Mechanically and thermally stable
      • Excellent pattern transfer down to sub-100 nm features

      Data sheet:

      Applications:

      • Transparent working stamp fabrication
      • Cost efficient alternative to quartz stamp
      • UV-based and thermal imprinting, nanoimprint lithography

      mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

      mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

      NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.

      • Solvent-free, low viscosity
      • Excellent imprint characteristics
      • Compatibility to various mold materials (Ni, Si, OrmoStamp®)
      • Good adhesion to PC and PET substrates
      • Excellent dry-etch resistance for pattern transfer

      Data sheet:

      Applications:

      • UV-based NIL
      • Pattern Transfer
      • Permanent Applications

      • Mold Replication

        • Mold Replication

        OrmoStamp® UV-curable Hybrid Polymer with High Transparency

        OrmoStamp® UV-curable Hybrid Polymer with High Transparency

        Ormostamp® for working stamp fabrication

        • Highly transparent for UV and visible light
        • Mechanically and thermally stable
        • Excellent pattern transfer down to sub-100 nm features

        Data sheet:

        Applications:

        • Transparent working stamp fabrication
        • Cost efficient alternative to quartz stamp
        • UV-based and thermal imprinting, nanoimprint lithography

      • Pattern Transfer

        • Pattern Transfer

        mr-I T85 Thermoplastic polymer for Thermal NIL

        mr-I T85 Thermoplastic polymer for Thermal NIL

        Non-polar thermoplastic for permanent applications.

        • High chemical resistance
        • Excellent UV-vis transparency
        • Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
        • Appropriate for bio- and lab-on-chip applications

        Data sheet:

        Applications:

        • Thermal NIL
        • Lab-on-chip systems

        mr-NIL 6000E UV-cure Resist for Thermal NIL

        mr-NIL 6000E UV-cure Resist for Thermal NIL

        UV-curable material for permanent applications with isothermal processing

        • Excellent film quality on various substrate materials
        • Very low residual layer thickness < 10 nm
        • Excellent pattern transfer fidelity

        Data sheet:

        Applications:

        • Thermal NIL
        • Pattern Transfer

        mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps

        mr-NIL200 UV-curable Material for Photoimprint with Impermeable Stamps

        Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass.
        Very low release forces
        No adhesion promoter or primer necessary
        No oxygen inhibition
        Mask for pattern transfer processes (dry and wet etching)

        Data Sheet

        Applications:

        • UV-based
        • NIL Pattern transfer

        mr-NIL210 Photo-curable Nanoimprint Resist

        mr-NIL210 Photo-curable Nanoimprint Resist

        NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials.

        • Increased dry etching resistance in demanding plasma processes
        • Excellent reproducibility enabling high volume production
        • Film thickness adjustable from sub 100 nm range up to several microns

        Data sheet:

        Applications:

        • UV-based NIL
        • Pattern Transfer

        mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance

        mr-NIL212FC Fast Curing Photo-curable Nanoimprint Resist with Superior Dry Etch Performance

        mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.

        • Excellent stability in plasma etching processes
        • Fast curing even with low intensity light exposure sources
        • Excellent liquid thin film stability and thin film quality
        • Outstanding compatibility with flexible stamp materials
        • Residue-free removal with oxygen plasma post-cure

        Data Sheet

        Applications

        • Soft UV-based NIL
        • Etch mask for pattern transfer processes (dry and wet etching)
        • Fabrication of nanostructures

        mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist

        mr-XNIL26SF Solvent-free UV-curable Nanoimprint Resist

        NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects.

        • Very low release forces
        • Excellent wetting properties
        • Fast curing, high resolution

        Data sheet:

        Ancillaries

        • mr-APS1 Adhesion Promoter
        • ma-T 1050 Thinner

        Applications:

        • UV-based NIL
        • Pattern Transfer
        • Micro/nano high aspect ratio patterning

        mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

        mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

        NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.

        • Solvent-free, low viscosity
        • Excellent imprint characteristics
        • Compatibility to various mold materials (Ni, Si, OrmoStamp®)
        • Good adhesion to PC and PET substrates
        • Excellent dry-etch resistance for pattern transfer

        Data sheet:

        Applications:

        • UV-based NIL
        • Pattern Transfer
        • Permanent Applications

      • Permanent Applications

        • Permanent Applications

        OrmoClear® Highly Transparent Materials for Micro-optics

        OrmoClear® Highly Transparent Materials for Micro-optics

        Designed for the production of micro-optical components and wafer scale patterning

        • For UV imprint and UV moulding
        • Highly transparent for near UV and VIS down to 350 nm
        • High thermal and mechanical stability
        • Thickness up to 270 μm by spin coating (OrmoClear®30)

        Data sheet:

        Ancillaries:

        • OrmoDev
        • OrmoPrime®08
        • OrmoThin

        Applications:

        OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

        OrmoComp®/OrmoClear®FX UV-curable Hybrid Polymers for Moulding of Optical Components

        Designed for the production of micro-optical components produced by UV moulding of optical components

        • UV patterning (lithography, moulding and imprint)
        • Highly transparent for VIS and near UV down to 350 nm
        • High thermal, chemical and mechanical stability of cured patterns
        • High resolution down to 100 nm feature size

        Data sheet:

        Ancillaries:

        • OrmoDev
        • OrmoPrime®08
        • OrmoThin

        Applications:

        OrmoStamp® UV-curable Hybrid Polymer with High Transparency

        OrmoStamp® UV-curable Hybrid Polymer with High Transparency

        Ormostamp® for working stamp fabrication

        • Highly transparent for UV and visible light
        • Mechanically and thermally stable
        • Excellent pattern transfer down to sub-100 nm features

        Data sheet:

        Applications:

        • Transparent working stamp fabrication
        • Cost efficient alternative to quartz stamp
        • UV-based and thermal imprinting, nanoimprint lithography

        mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

        mr-UVCur26SF Photo-curable Nanoimprint Resist for Roll-to-Roll Processes

        NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes.

        • Solvent-free, low viscosity
        • Excellent imprint characteristics
        • Compatibility to various mold materials (Ni, Si, OrmoStamp®)
        • Good adhesion to PC and PET substrates
        • Excellent dry-etch resistance for pattern transfer

        Data sheet:

        Applications:

        • UV-based NIL
        • Pattern Transfer
        • Permanent Applications

      Thermal NIL:

      Thermal NIL:

      mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL

      mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL

      Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns

      • Excellent properties for thermal NIL
      • Longer life-time of anti-sticking layers on the mold
      • High plasma etch resistance

      Data sheet:

      Applications:

      • Thermal NIL
      • Pattern Transfer

      mr-I 9000M Thermal Cure Polymers for Thermal NIL

      mr-I 9000M Thermal Cure Polymers for Thermal NIL

      mr-I 9000M for micro and nanofabrication

      • Compatible with various substrates including Si, Si02 and Al
      • Short imprint cycle
      • Thermal curing during imprint

      Data sheet:

      Applications:

      • Thermal NIL
      • Pattern Transfer
      • Permanent Applications

      mr-I T85 Thermoplastic polymer for Thermal NIL

      mr-I T85 Thermoplastic polymer for Thermal NIL

      Non-polar thermoplastic for permanent applications.

      • High chemical resistance
      • Excellent UV-vis transparency
      • Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
      • Appropriate for bio- and lab-on-chip applications

      Data sheet:

      Applications:

      • Thermal NIL
      • Lab-on-chip systems

      SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer

      SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer

      Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns

      • Excellent flowability
      • Superior demolding characteristics
      • Imprints can be performed at moderate temperatures in the range of 110 – 140°C.

      Data sheet:

      Applications:

      • Thermal NIL
      • Pattern Transfer

      • Pattern Transfer

        • Pattern Transfer

        mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL

        mr-I 7000R / mr-I 8000R Thermoplastic Polymers for Thermal NIL

        Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns

        • Excellent properties for thermal NIL
        • Longer life-time of anti-sticking layers on the mold
        • High plasma etch resistance

        Data sheet:

        Applications:

        • Thermal NIL
        • Pattern Transfer

        mr-I 9000M Thermal Cure Polymers for Thermal NIL

        mr-I 9000M Thermal Cure Polymers for Thermal NIL

        mr-I 9000M for micro and nanofabrication

        • Compatible with various substrates including Si, Si02 and Al
        • Short imprint cycle
        • Thermal curing during imprint

        Data sheet:

        Applications:

        • Thermal NIL
        • Pattern Transfer
        • Permanent Applications

        mr-I T85 Thermoplastic polymer for Thermal NIL

        mr-I T85 Thermoplastic polymer for Thermal NIL

        Non-polar thermoplastic for permanent applications.

        • High chemical resistance
        • Excellent UV-vis transparency
        • Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
        • Appropriate for bio- and lab-on-chip applications

        Data sheet:

        Applications:

        • Thermal NIL
        • Lab-on-chip systems

        SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer

        SIPOL Series Thermal NIL Resists for High Aspect Ratio Pattern Transfer

        Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns

        • Excellent flowability
        • Superior demolding characteristics
        • Imprints can be performed at moderate temperatures in the range of 110 – 140°C.

        Data sheet:

        Applications:

        • Thermal NIL
        • Pattern Transfer

      • Permanent Applications

        • Permanent Applications

        mr-I 9000M Thermal Cure Polymers for Thermal NIL

        mr-I 9000M Thermal Cure Polymers for Thermal NIL

        mr-I 9000M for micro and nanofabrication

        • Compatible with various substrates including Si, Si02 and Al
        • Short imprint cycle
        • Thermal curing during imprint

        Data sheet:

        Applications:

        • Thermal NIL
        • Pattern Transfer
        • Permanent Applications

        mr-I T85 Thermoplastic polymer for Thermal NIL

        mr-I T85 Thermoplastic polymer for Thermal NIL

        Non-polar thermoplastic for permanent applications.

        • High chemical resistance
        • Excellent UV-vis transparency
        • Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices
        • Appropriate for bio- and lab-on-chip applications

        Data sheet:

        Applications:

        • Thermal NIL
        • Lab-on-chip systems

  • Printed Heaters & Thermal Targets

  • RFID and Cell Phone Antennas

  • Solar Panels

  • Surface Mount Component Attachment

  • Touch Screens